Integrated Plated Lead Structure to Prevent Interface Peeling
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Solution Overview
Problem
Peeling occurs at the interface between plating layers in semiconductor devices with multiple leads during the manufacturing process, leading to potential failures.
Innovation Solution
The semiconductor device features a conductive portion with integrally formed mounting and terminal portions made of a single plating layer, eliminating interfaces and enhancing structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple plating layers are used to form the conductive portion, then electrical conductivity and current carrying capacity are improved, but peeling occurs at the interface between plating layers reducing reliability
Solution Approach 1:
The patent merges the mounting portion and terminal portion into a single integrally formed conductive portion made of one plating layer, eliminating the interface between separate plating layers that causes peeling. This combining approach maintains electrical conductivity while removing the weak interface point.
Solution Approach 2:
The conductive portion is segmented into a mounting portion and a terminal portion with different geometric characteristics - the mounting portion has a larger cross-sectional area for supporting the semiconductor element, while the terminal portion has a smaller cross-sectional area for external connection. This segmentation allows functional optimization without creating harmful interfaces.
2Ease of manufacture
If the mounting portion and terminal portion are formed as separate parts, then manufacturing flexibility and adaptability are improved, but assembly complexity and potential for assembly defects increase
Solution Approach 1:
The mounting portion and terminal portion are combined into a single integrally formed conductive portion, eliminating the need for separate assembly steps and reducing the risk of assembly defects while maintaining the functional differences between the two regions.
Solution Approach 2:
The conductive portion exhibits local quality variations through its geometry - the mounting portion has a larger cross-sectional area suited for semiconductor element mounting, while the terminal portion has a smaller cross-sectional area for external connections. This local differentiation achieves functional specialization within a unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design prevents peeling at the interface, ensuring reliable electrical connections and improved durability of the semiconductor device.
Implementation Method 1
the conductive portion includes a plating layer
Data Source
AI summary
A semiconductor device includes: a conductive portion; and a semiconductor element mounted on the conductive portion, wherein the conductive portion is made of a plating layer, wherein the conductive portion includes a mounting portion having a mounting surface on which the semiconductor element is mounted, and a terminal portion extending to an opposite side of the semiconductor element with respect to the mounting portion, wherein the mounting portion extends in a first direction along the mounting surface more than the terminal portion, and wherein the mounting portion and the terminal portion are integrally formed.