Plated Pillar Lead Semiconductor Package Short Circuit Prevention
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Solution Overview
Problem
Conventional semiconductor packaging using solder for connecting conductive pillars to leads results in high-temperature reflow processes that increase solder width, leading to increased probability of short circuits and packaging failures due to reduced distance between pillars.
Innovation Solution
A semiconductor device with plated pillars and leads, where a metal plating layer, such as copper, is electroplated on the conductive pillars and leads to directly connect them, filling gaps and reducing the need for solder, thereby minimizing manufacturing time and costs while reducing the likelihood of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to electrically connect conductive pillars to leads, then electrical connection is achieved, but the high-temperature reflow process increases solder width, reducing distance between pillars and increasing probability of short circuits
Solution Approach 1:
The patent removes solder from the connection process entirely, extracting the problematic element that causes width increase and short circuits. Instead of using solder with reflow processing, the invention directly connects conductive pillars to leads through mechanical insertion and bonding, eliminating the source of the precision problem while maintaining electrical connectivity
Solution Approach 2:
The patent replaces the thermal-mechanical soldering system with a direct mechanical connection system. Conductive pillars are inserted into holes in the leads and bonded through mechanical means rather than thermal reflow, substituting a process that causes width expansion with one that maintains precise dimensional control
2Reliability
If solder reflow process is performed, then electrical connection between pillars and leads is achieved, but manufacturing time is increased due to high-temperature processing
Solution Approach 1:
The patent extracts the time-consuming solder reflow process from the manufacturing sequence. By eliminating solder entirely and using direct mechanical insertion and bonding of conductive pillars to leads, the invention removes the high-temperature processing step that extends manufacturing time while maintaining connection reliability
Solution Approach 2:
The patent skips the intermediate solder application and reflow steps, rushing directly from pillar insertion to final bonding. This streamlined process eliminates unnecessary processing stages, reducing overall manufacturing time while achieving the same electrical connection function
3Reliability
If solder is used for connection, then electrical connectivity is established, but manufacturing cost increases due to additional materials and processes
Solution Approach 1:
The patent extracts solder material and associated processing steps from the manufacturing system. By using conductive pillars that are directly inserted and bonded to leads without solder, the invention eliminates material costs for solder and reduces process complexity, thereby lowering manufacturing costs while maintaining electrical connectivity
Solution Approach 2:
The patent discards the solder material approach in favor of reusable conductive pillars that can be precisely manufactured and inserted. This substitution reduces waste and material costs associated with solder while improving process efficiency and reducing overall manufacturing expenses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The plated layer connection method reduces manufacturing time and costs, and minimizes packaging failures by eliminating the need for solder reflow processes, thus enhancing the reliability of semiconductor packages.
Implementation Method 1
a metal plating layer, such as copper, is electroplated on the conductive pillars and leads to directly connect them, filling gaps
Data Source
AI summary
A semiconductor device with plated pillars and leads is disclosed and may include a semiconductor die comprising a conductive pillar, a conductive lead electrically coupled to the conductive pillar, a metal plating layer covering the conductive lead and conductive pillar, and an encapsulant material encapsulating the semiconductor die and at least a portion of the plating layer. The pillar, lead, and plating layer may comprise copper, for example. The plating layer may fill a gap between the pillar and the lead. A portion of the metal plating layer may, for example, comprise an external lead. The metal plating layer may cover a side surface of the pillar and a top surface, side surface, and at least a portion of a bottom surface of the lead. The metal plating layer may cover side and bottom surfaces of the pillar and top, side, and at least a portion of bottom surfaces of the conductive lead.