Plated Plastic Connector Assembly for Moisture-Resistant Contacts
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Solution Overview
Problem
Existing connector assemblies for electronic devices face challenges in being moisture-resistant, lightweight, space-efficient, and easily manufacturable, especially when exposed to liquids and used in wearable devices where user fatigue and large-scale production demands are considerations.
Innovation Solution
The use of two materials with distinct affinities for plating, where one material is plated for contact functionality and the other resists plating to create a moisture-resistant seal, combined with lightweight materials like plastics and thermoplastic polymers, and manufacturing techniques such as injection molding and 3-D printing to form compact and durable connector assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connector assemblies are made with traditional materials and sealing methods, then moisture resistance can be improved, but weight increases and manufacturing complexity increases
Solution Approach 1:
The patent uses a composite material system consisting of a plating-receptive material (such as metal or plated plastic) and a plating-resistant material (such as unplated plastic). These materials are molded together to form a unified connector assembly that achieves moisture resistance through material property differentiation rather than traditional sealing methods, reducing weight while maintaining reliability.
Solution Approach 2:
Different regions of the connector assembly have different material properties: the plating-receptive material provides conductive and moisture-resistant contacts, while the plating-resistant material provides structural support and separation without requiring plating. This local differentiation of material properties achieves moisture resistance throughout the assembly without requiring heavy sealing materials.
2Volume of moving object
If connector assemblies are made compact to save space, then space efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent combines multiple functions into a single molded component. The plating-receptive and plating-resistant materials are co-molded together to form an integrated connector assembly that includes contacts, separators, and structural elements in one piece. This merging reduces the number of separate parts and assembly steps, making compact design more achievable without proportionally increasing manufacturing precision requirements.
3Reliability
If connector assemblies use multiple materials molded together for moisture resistance, then moisture resistance improves, but manufacturing process complexity increases
Solution Approach 1:
The plating process is performed on the plating-receptive material before the plating-resistant material is molded over it. This preliminary plating action ensures that the conductive surfaces are established before the final protective structure is formed, simplifying the overall manufacturing sequence while achieving the desired moisture resistance through the multi-material construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides moisture-resistant, lightweight, and space-efficient connector assemblies that can be readily manufactured, ensuring reliable performance in various electronic devices while meeting demands for both functionality and user comfort.
Implementation Method 1
The first material, having an affinity for plating materials, can be plated and used as contacts
Data Source
AI summary
Connector assemblies and contacts that can be moisture-resistant, light-weight, space efficient, and can be readily manufactured. The connector assembly can be formed of two or more materials that can be molded together to reduce the chance of leakage at seams between the two materials. One of the two materials can have an affinity for plating materials while the other material can have an aversion to plating materials. The first material can be plated and used as contacts, while the second can resist plating and can be used to separate regions of the first material into two or more contacts.