Plated Snap-Action Spring Switch for Precise Current-Carrying Adjustment
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Solution Overview
Problem
Existing snap switches with current-carrying springs face challenges in achieving both high mechanical and thermal stability and good electrical conductivity, particularly due to the harmful nature of copper-beryllium alloys, and often result in increased production variability and complex technical efforts to combine these properties.
Innovation Solution
A current-carrying spring is produced from a multi-layer plated material with the plating displaced at adjustment points during assembly, ensuring precise deformation and optimal electrical conductivity, using non-ferrous or noble metals for plating over a spring steel core, which reduces production variability and maintains defined jump movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-beryllium alloy is used for the current-carrying spring, then high mechanical and thermal stability and good electrical conductivity are achieved, but health hazards and potential future restrictions are introduced
Solution Approach 1:
The patent uses a composite structure consisting of a spring steel core providing mechanical stability and a copper plating layer providing electrical conductivity. This composite approach achieves the performance of copper-beryllium alloy without using harmful beryllium, as the spring steel core replaces the copper-beryllium base material while the copper plating maintains electrical conductivity.
Solution Approach 2:
The patent applies copper plating only to specific regions of the spring where electrical conductivity is needed, rather than coating the entire spring. This localized plating approach optimizes electrical conductivity at contact points while minimizing the amount of plated material and reducing interference with the spring's mechanical properties in non-contact regions.
2Reliability
If the spring is fully plated with copper to improve electrical conductivity, then good electrical conductivity is achieved, but manufacturing variations and deformation precision are increased
Solution Approach 1:
The patent implements partial plating where copper coating is applied only to specific regions of the spring that require electrical conductivity, such as contact areas, while leaving adjustment points and bending regions unplated. This selective plating maintains electrical conductivity where needed while preserving the spring steel's deformability and dimensional stability at critical adjustment locations.
Solution Approach 2:
The spring is divided into functionally distinct regions: plated regions for electrical conductivity and unplated regions for mechanical adjustment and deformation. This segmentation allows each region to be optimized for its specific function without compromising the other, reducing manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved electrical conductivity and precise deformation of the spring, minimizing the disruptive influence of the plating and reducing manufacturing tolerances, thus enhancing the performance and reliability of snap switches while avoiding the use of harmful metals.
Implementation Method 1
a first electrical connection (167) is established at a first end (168) of the coil spring (16) and a second electrical connection (169) is established at a second end (169) of the coil spring (16)
Implementation Method 2
The basic shape of the spring (16) is stamped from a spring steel strip clad on both sides with an electrically conductive non-ferrous metal, such as copper
Data Source
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AI summary
The invention relates to a snap-action switch (16, 18, 20), which has a current-conducting snap-action spring (16), which can be brought into two resting positions by mechanical actuation and is produced from a multi-layer plated material, the plating being partly or completely displaced and/or absent at adjustment points of the snap-action spring (16), and the snap-action switch (16, 18, 20) being adjusted in that the snap-action spring (16) has been deformed at the adjustment points during mounting in the snap-action switch (16, 18, 20).