Plated Electroconductive Substrate With Trench-Filled Flexible Pattern
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Solution Overview
Problem
Existing electroconductive substrates for touch panels and displays face challenges in maintaining high transparency, electroconductivity, and flexibility while being cost-effective, as they tend to peel off or lose conductivity when bent due to the use of expensive materials like ITO or electroconductive nanowires, and the etching process increases production costs.
Innovation Solution
An electroconductive substrate is designed with a base material, a foundation layer containing a catalyst, and an electroconductive pattern layer formed through metal plating, where the trench is filled with the pattern layer, and a mixed region is created to enhance adhesion, with specific thickness and surface roughness ratios to prevent peeling and maintain conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ITO or electroconductive nanowire is used to form an electroconductive pattern layer, then high transparency and electroconductivity are achieved, but production cost increases significantly
Solution Approach 1:
The patent replaces expensive ITO or electroconductive nanowire with a cheaper electroconductive paste containing metal particles (such as silver, aluminum, or copper) as the active electroconductive component. This substitution significantly reduces material cost while maintaining adequate electroconductivity for the antenna application.
Solution Approach 2:
The patent optimizes the composition and particle size distribution of the electroconductive paste to achieve the desired electroconductivity at lower cost. By controlling the metal particle concentration, size, and shape, the paste provides sufficient electrical performance without requiring expensive materials like ITO.
2Manufacturing precision
If etching is used to form a fine electroconductive pattern layer, then a fine pattern can be achieved, but the number of production steps increases
Solution Approach 1:
The patent removes the etching process entirely from the production sequence. Instead of forming a continuous electroconductive layer and then etching away unwanted portions, the electroconductive paste is directly patterned through printing or coating methods, eliminating the exposing, developing, etching, and peeling steps required in conventional processes.
Solution Approach 2:
The patent replaces the mechanical/chemical etching system with a direct deposition system. The electroconductive paste is applied in its final patterned form using printing, coating, or similar deposition techniques, substituting the multi-step etching mechanism with a simpler direct formation approach.
3Ease of manufacture
If an electroconductive pattern layer is formed by filling a trench, then production cost is reduced, but the electroconductive layer peels off or electroconductivity decreases when bent
Solution Approach 1:
The patent uses a resin-based foundation layer with controlled flexibility that can accommodate bending without causing the electroconductive paste to peel or crack. The resin composition and thickness are optimized to provide mechanical flexibility while maintaining adequate support for the electroconductive pattern.
Solution Approach 2:
The patent creates a composite structure consisting of the resin foundation layer, the electroconductive paste containing metal particles, and optional overlying layers. This composite design provides both mechanical flexibility for bending and electrical conductivity for antenna function, while the resin matrix holds the metal particles in place during deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses peeling and maintains electroconductivity even when bent, while being cost-effective by using metal plating and a catalyst-based foundation layer, ensuring high transparency and flexibility in the electroconductive substrate.
Implementation Method 1
a foundation layer which is disposed on a base material and contains a catalyst
Implementation Method 2
an electroconductive pattern layer including metal plating
Data Source
AI summary
An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.