Plated Through Hole Socket for Pin-to-BGA Conversion
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Solution Overview
Problem
Configuring a plated through hole to include a socket that can engage with a pin and be coupled to a solder ball, while withstanding the power requirements of electronic devices without additional electrical routing.
Innovation Solution
An electronic interconnect is created with a substrate having a passageway closed at one end, featuring a plated through hole socket coupled to the passageway, a contact with a pin that engages with the socket, and a solder ball connected to the socket, allowing direct conversion from a pin grid array to a ball grid array without additional electrical routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plated through hole is configured to include a socket that can engage with a pin and be coupled to a solder ball, then the electrical connection robustness and mechanical stability are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple functions into a single plated through hole structure: the socket provides both mechanical engagement for the pin and electrical connection to the solder ball, eliminating the need for separate routing structures. This integration maintains reliability while reducing overall device complexity.
Solution Approach 2:
The plated through hole socket is designed to perform multiple functions simultaneously: it engages with the pin mechanically, provides electrical conductivity, and couples to the solder ball for additional electrical connection. This multi-functionality resolves the contradiction by achieving robust electrical connection without adding separate dedicated structures for each function.
2Power
If additional electrical routing is added to meet power requirements, then the power capacity is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The plated through hole structure combines mechanical support and electrical power transmission functions into a single integrated component. The socket engages with the pin while simultaneously providing electrical connection to the solder ball, eliminating the need for additional separate routing structures to meet power requirements.
Solution Approach 2:
The patent uses the existing plated through hole structure to carry both mechanical and electrical functions, rather than creating additional routing structures. This approach meets power requirements by utilizing the already-present conductive pathway, avoiding increased device complexity.
3Ease of manufacture
If a plated through hole socket is configured to withstand power requirements without additional electrical routing, then the manufacturing process is simplified, but the structural strength and power handling capability must be significantly increased
Solution Approach 1:
The plated through hole socket utilizes composite construction with a metallic base structure providing mechanical strength and a conductive plating layer providing electrical conductivity. This composite approach allows the single structure to handle both mechanical loads and high power requirements without additional routing, maintaining manufacturing simplicity while achieving necessary strength and power handling capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust and efficient electrical connection that meets the power requirements of electronic devices by eliminating the need for additional electrical routing, enhancing mechanical stability and conductivity between the contact and solder ball.
Implementation Method 1
The passageway may be plated to create a plated through hole socket
Data Source
AI summary
An electronic interconnect may include a substrate. The substrate may include a passageway in the substrate. The passageway may extend from a first surface of the substrate toward a second surface of the substrate. The passageway may be closed at an end of the passageway. The electronic interconnect may include a plated through hole socket coupled to the passageway. The electronic interconnect may include a contact. The contact may include a pin. The pin may be configured to engage with the plated through hole socket. The electronic interconnect may include a solder ball. The solder ball may be coupled to the plated through hole socket.