Platen Assembly Thermal Break Gap Design
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Solution Overview
Problem
Current platen assemblies are not suitable for operating over a wide substrate temperature range of −100° C. to 750° C. due to thermal properties and differences in the coefficient of thermal expansion among components, necessitating dedicated assemblies for room temperature and elevated temperatures.
Innovation Solution
A platen assembly with a base and clamping layer featuring a gap that circulates fluid for cooling in one mode and provides a thermal break by reducing pressure in another mode, minimizing physical contact to allow operation across a broad temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single platen assembly is used for both room temperature and elevated temperature operations, then device complexity is reduced, but thermal stress and reliability deteriorate due to differences in coefficient of thermal expansion among components
Solution Approach 1:
The platen assembly is segmented into distinct functional layers: a base structure, a clamping layer, and a thermal management layer with fluid channels. This segmentation allows each layer to be optimized for its specific function and to expand/contract independently, reducing thermal stress while maintaining a single integrated assembly
Solution Approach 2:
The patent changes the physical state and thermal properties of the assembly by introducing fluid-filled channels that can be pressurized or evacuated. By changing the fluid pressure parameter, the assembly transitions between thermal conduction modes, enabling reliable operation across wide temperature ranges without requiring multiple dedicated assemblies
2Strength
If the gap between base and clamping layer is minimized for structural integrity, then strength is improved, but thermal regulation capability deteriorates
Solution Approach 1:
A fluid medium is introduced as an intermediary between the base and clamping layer. This fluid can be selected to provide appropriate thermal conductivity for the desired operation, allowing the gap to serve both structural and thermal management functions simultaneously
3Temperature
If fluid is continuously circulated in the gap for thermal management, then temperature control is improved, but energy consumption and system complexity worsen
Solution Approach 1:
Instead of continuous fluid circulation, the system uses periodic or on-demand fluid delivery. The pump operates only when temperature adjustment is required, reducing energy consumption while maintaining effective thermal control through controlled fluid flow cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient temperature regulation from room temperature to 750° C. by optimizing thermal conduction and convection, reducing heat loss and maintaining substrate security during processing.
Implementation Method 1
The gap is configured to circulate a fluid during a first operating mode
Implementation Method 2
The gap is configured to circulate a fluid during a first operating mode
Implementation Method 3
The vacuum system is configured to generate a pressure in the gap during the second operating mode to cause a thermal conduction between the base and the clamping layer to be less in the second operating mode than in the first operating mode
Data Source
AI summary
A platen assembly includes a base and a clamping layer fixed to the base. A portion of the base that faces the clamping layer and a portion of the clamping layer that faces the base define a gap between the base and the clamping layer. The gap is configured to circulate a fluid during a first operating mode and provide a thermal break during a second operating mode. The platen assembly is capable of operating over a wide temperature range.