Platform Integrated Circuit for Medical Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated circuits customized for specific medical devices cannot be used as common components across different devices with varying functions, limiting further cost reduction through component communalization.
Innovation Solution
A platform integrated circuit is developed that uses a common set of components across multiple medical devices, complemented by a functional integrated circuit to enhance performance, reducing chip size and costs by optimizing CPU performance and utilizing a gate array for parallel processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated circuits are customized as dedicated components for one device, then device performance is optimized, but component reusability and cost reduction through communalization are limited
Solution Approach 1:
The integrated circuit is divided into two separate modules: a platform integrated circuit containing common functional blocks (CPU, memory, I/O interfaces, power management) that can be reused across multiple devices, and a functional integrated circuit containing device-specific functions. This segmentation allows the common platform to be communalized while the functional module is customized for each device, resolving the contradiction between reusability and performance optimization.
Solution Approach 2:
The platform integrated circuit is designed with universal functionality that can serve multiple different medical devices. By incorporating generic functional blocks such as CPU, memory, I/O interfaces, and power management units that are applicable across various device types, the platform IC achieves multi-functionality and can be reused in different applications, thereby improving component reusability without sacrificing device performance through the addition of specialized functional ICs.
2Reliability
If a single integrated circuit is made to include all functions for one device, then device performance is achieved, but cost reduction through component communalization cannot be further achieved
Solution Approach 1:
The system is segmented into a reusable platform integrated circuit and a device-specific functional integrated circuit. The platform IC can be mass-produced and stocked for multiple device types, reducing manufacturing costs through economies of scale. The functional IC is produced in smaller quantities specific to each device type. This segmentation enables cost reduction through communalization of the platform component while maintaining device performance.
Solution Approach 2:
The design allows the platform integrated circuit to be recovered and reused across multiple device iterations and types. Instead of creating a new single-chip solution for each device, the common platform is retained and reused, while only the functional module needs to be redesigned. This recovery and reuse of the platform IC significantly reduces development and manufacturing costs.
3Ease of manufacture
If the integrated circuit chip size is reduced for communalization, then cost reduction is achieved, but accommodating all necessary functions becomes difficult
Solution Approach 1:
The functional requirements are segmented between two separate integrated circuits: the platform IC contains common functions (CPU, memory, I/O, power management) and the functional IC contains device-specific functions. This segmentation allows each chip to be smaller and more focused, making the platform IC suitable for communalization and cost reduction, while the functional IC provides the necessary specialized capabilities for different device types.
Solution Approach 2:
The platform integrated circuit and functional integrated circuit are merged into a single device through electrical connection and integration. While physically separate chips, they work together as a unified system, combining the benefits of communalized common functions with customized device-specific functions. This merging approach allows cost reduction through platform IC reuse while maintaining full functional coverage through the combined system.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
To provide an integrated circuit which can achieve cost reduction, and a medical device using the same. Provided is a common integrated circuit 100 used for a plurality of medical devices respectively, the integrated circuit used for at least any one of the plurality of medical devices 10 being connected to a functional complement integrated circuit 110 which complements a part of functions of the integrated circuit according to a function of the medical device.