Interchangeable Platform Support with Segmented Thermal Control
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Solution Overview
Problem
In generative layer construction devices, the heat transfer between the carrier and the substrate plate is impaired due to air gaps caused by minor deformations in the clamping system, leading to reduced heat transfer and potential thermal stress in the manufactured object.
Innovation Solution
An interchangeable platform support system with a clamping device for precise positioning and a separate pressure device that ensures good heat transfer by pressing the temperature control system against the substrate plate, allowing for independent operation of clamping and pressure functions to maintain accuracy and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a rigid clamping system is used to precisely position the substrate plate, then positioning accuracy is improved, but air gaps form due to minor deformations which impair heat transfer
Solution Approach 1:
The system is divided into two independent functional components: a rigid clamping device for precise positioning and a separate pressure device for ensuring thermal contact. This segmentation allows each component to optimize its specific function without compromising the other.
Solution Approach 2:
A pressure device acts as an intermediary between the substrate plate and the carrier, applying additional force to eliminate air gaps and ensure optimal thermal contact while the clamping device maintains positioning accuracy.
2Loss of energy
If the substrate plate is firmly screwed to the carrier, then heat transfer is improved, but the substrate plate cannot be automatically exchanged
Solution Approach 1:
The connection functions are segmented into clamping (for secure holding and heat transfer) and positioning (for precise alignment). This allows the substrate plate to be firmly held during operation while maintaining automatic exchangeability through the positioning mechanism.
Solution Approach 2:
Different regions of the substrate plate-carrier interface have different functions: the clamping regions provide secure mechanical attachment for heat transfer, while the positioning regions enable automatic exchangeability through precise alignment features.
3Ease of operation
If the substrate plate is not firmly screwed to the carrier, then automatic exchangeability is improved, but thermal deformation occurs due to temperature gradients
Solution Approach 1:
The pressure device serves as an intermediary that applies localized pressure to eliminate air gaps and reduce temperature gradients, preventing thermal deformation while allowing the substrate plate to remain loosely attached for automatic exchangeability.
Solution Approach 2:
The system dynamically adjusts the pressure parameter between the substrate plate and carrier, applying sufficient pressure during operation to ensure thermal contact and stability, while allowing easy release for automatic exchange.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures precise positioning of the substrate plate and enhances heat transfer between the carrier and the substrate plate, improving the thermal control and reproducibility of the manufacturing process, reducing thermal stress and warping of the object.
Implementation Method 1
a pressure device which is suitable for pressing at least part of the temperature control system against a changing platform when this is clamped in the clamping device
Implementation Method 2
the construction material is often preheated to a (working) temperature which, for example, is slightly below (but can also be below) the temperature at which the particles of the normally powdered building material combine with each other
Implementation Method 3
To warp the manufactured object as a result of thermal stress To avoid this, DE 101 08 612 C1 proposes adjusting the temperature distribution in the powder cake present inside the construction container by heating the walls of the construction container and in particular heating the construction base
Data Source
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Figure 2
AI summary
A platform carrier for an additive manufacturing device, designed to produce at least one three-dimensional object by layer-wise solidifying a powdered build-up material at the locations corresponding to the at least one object in the respective layers on a platform carrier (121), comprises a clamping device (115, 116) for releasably fixing a position of the platform carrier (121) relative to the position of the platform carrier, a temperature control system (111) designed to supply heat energy to at least a part of its surroundings and/or to remove heat energy from at least a part of its surroundings, and a pressure device (112) suitable for pressing at least a part of the temperature control system (111) against a platform carrier (121) when the platform carrier is clamped in the clamping device (115, 116).