Platformed Die Structure to Prevent Molding Layer Separation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional semiconductor packages using flip chip technology face issues with the die separating from the molding layer due to thermal expansion differences, as the molding layer does not cover the top surface of the die.

Innovation Solution

The die design includes a platform around the top surface that is lower than the top surface and perpendicularly connected to the side surfaces, allowing the molding layer to cover the platform and hook onto the die, preventing separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the molding layer does not cover the top surface of the die, then the die structure is simple and easy to manufacture, but the die easily separates from the molding layer due to thermal expansion differences

Engineering Contradiction:

Improveease of manufactureVSAvoidreliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces a platform structure that extends horizontally from the side surface of the die, creating an additional dimensional feature. This platform protrudes outward to form a hook-like structure that the molding layer can wrap around, transforming a simple vertical stacking arrangement into a multi-dimensional interlocking configuration that prevents separation while maintaining manufacturing simplicity

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The platform acts as an intermediary structure between the die and the molding layer. By providing this intermediate hook-like feature, the platform enables the molding layer to mechanically interlock with the die through thermal expansion and contraction, serving as a mediator that prevents direct separation between the die and molding layer while accommodating thermal stress

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents the die from separating from the molding layer, enhancing the structural integrity and reliability of the semiconductor package.

Implementation Method 1

the difference in coefficient of thermal expansion between the die 110 and the molding layer 140 results in the side surfaces of the die 110 easily separating from the molding layer 140

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20250125216A1Die and manufacturing method thereof as well as semiconductor package with the same

Publication Date: 2025.04.17 ORIENT SEMICONDUCTOR ELECTRONICS LTD

AI summary

The present disclosure provides a die. The die of the present disclosure has a top surface, a plurality of side surfaces, a bottom surface, a circuit layer and a platform. The bottom surface is connected to the side surfaces. The circuit layer is formed on the bottom surface. The platform is disposed around the top surface and is parallel to the top surface and the bottom surface. The distance from the platform to the bottom surface is less than that from the top surface to the bottom surface. The platform is perpendicularly connected to the side surfaces. The present disclosure further provides a method of manufacturing the above die and a semiconductor package with the die.