Plating Apparatus Alignment Using Sensor Jigs
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Solution Overview
Problem
Conventional plating apparatuses face challenges in achieving precise alignment of substrate holders, anode holders, and regulation plates due to inferior machining accuracy of resin components, leading to non-uniform plating and requiring time-consuming and costly setup processes involving actual plating and layer thickness measurements.
Innovation Solution
A method using jigs with integrated sensors to measure and adjust the positional relations between substrate holders, anode holders, and regulation plates without performing plating, allowing for precise alignment and setup without actual plating treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin components are used for plating bath, substrate holder, anode holder, and regulation plate to provide chemical resistance, then chemical resistance is improved, but machining accuracy deteriorates leading to poor dimensional accuracy and alignment
Solution Approach 1:
The patent uses measurement jigs with sensors to create a digital model of the actual positions of resin components in the plating apparatus. This copying approach allows the system to capture the as-built geometry and use it for calculations, eliminating the need for high machining precision in the resin components themselves while maintaining plating uniformity through software-based compensation
Solution Approach 2:
The patent changes the approach from physically manufacturing components with high precision to measuring their actual positions and adjusting operational parameters accordingly. By measuring the actual positions of substrate holder, anode holder, and regulation plate, and using these measurements to calculate correction values, the system compensates for the poor machining accuracy of resin components
2Manufacturing precision
If conventional alignment method using actual plating and layer thickness measurement is used, then alignment accuracy is improved, but setup time and cost increase significantly
Solution Approach 1:
The patent performs preliminary measurement of the positions of substrate holder, anode holder, and regulation plate using measurement jigs with sensors before actual plating operations. This preliminary action captures the actual geometric relationships and enables calculation of correction values in advance, eliminating the need for time-consuming trial plating and layer thickness measurements
Solution Approach 2:
The patent replaces the mechanical trial-and-error alignment process (actual plating followed by layer thickness measurement) with an optical/electronic measurement system using sensors and lasers. This substitution enables non-contact, rapid measurement of component positions and automated calculation of alignment corrections, dramatically reducing setup time
3Manufacturing precision
If conventional alignment method is used, then alignment accuracy is improved, but additional cost for setting-up substrates is required
Solution Approach 1:
The patent uses measurement jigs that copy or simulate the positions of actual components without requiring real substrates. The sensors mounted on these jigs capture the geometric relationships, allowing alignment calculations to be performed using virtual models rather than physical consumable substrates
Solution Approach 2:
The patent introduces measurement jigs as intermediary devices between the alignment process and the actual plating process. These jigs serve as temporary substitutes that enable measurement and calculation without consuming real substrates, which would otherwise be required for trial plating and alignment verification
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces setup time and costs by enabling accurate alignment and improving in-plane uniformity of the plating layer, enhancing the efficiency and productivity of the plating process.
Implementation Method 1
measuring a positional relation between the first jig and the second jig installed in the plating bath using sensors included in either of the first jig and the second jig
Data Source
AI summary
There is provided a method of adjusting a plating apparatus and a measuring apparatus that can obtain position adjustment amounts/a position adjustment amount of a substrate holder, an anode holder, a regulation plate, and/or a paddle without carrying out plating treatment. There is provided the method of adjusting the plating apparatus that has a plating bath configured to be able to hold the substrate holder, the anode holder, and an electric field adjusting plate. The method of adjusting the plating apparatus has the steps of: installing a first jig at a position in the plating bath where the substrate holder is installed; installing a second jig at a position in the plating bath where the anode holder or the electric field adjusting plate is installed; measuring a positional relation between the first jig and the second jig installed in the plating bath using a sensor included in either of the first jig and the second jig; and adjusting an installation position of the substrate holder, the anode holder, or the electric field adjusting plate based on the measured positional relation.