Plating Anode With Through-Holes and Rear Face Plate for Bubble Regulation
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Solution Overview
Problem
In plating apparatuses, uneven accumulation of bubbles generated at the anode can lead to increased ion conduction resistance and deteriorate the uniformity of the plating film thickness.
Innovation Solution
The apparatus includes a plating tank with an anode having through holes, a substrate holder, a barrier membrane in close contact with the anode, and a rear face plate to regulate bubble accumulation on the anode's rear face, ensuring bubbles are discharged without affecting the ion conductive path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the barrier membrane is placed below a frame fixed in the plating tank, then the plating solution can flow along the substrate surface, but the barrier membrane separates from the frame when cathode chamber pressure exceeds anode chamber pressure, forming pockets that trap bubbles
Solution Approach 1:
The barrier membrane is preliminarily fixed to the front surface of the anode using adhesion, ensuring it remains in close contact before plating begins. This preliminary bonding prevents the membrane from detaching during pressure variations in the plating process.
Solution Approach 2:
The anode serves as an intermediary substrate to which the barrier membrane is bonded. By fixing the membrane to the anode rather than directly to the tank frame, the design allows the membrane to remain stable while accommodating pressure changes between chambers.
2Reliability
If bubbles accumulate on the substrate, barrier membrane, or resistor plate, then ion conduction resistance increases, but the plating film thickness uniformity deteriorates
Solution Approach 1:
The invention extracts and removes bubbles from the plating system by providing dedicated discharge paths. Bubbles are channeled through through-holes in the anode and gaps between components to discharge outlets, preventing their accumulation on critical surfaces.
Solution Approach 2:
The anode is designed with multiple through-holes that segment the bubble discharge path into multiple channels. This segmentation allows bubbles to be efficiently removed from different regions simultaneously, preventing localized accumulation that would affect plating uniformity.
3Adaptability or versatility
If a barrier membrane is placed between the anode and substrate holder, then the anode chamber and cathode chamber are separated, but bubbles generated at the anode can still accumulate on the barrier membrane
Solution Approach 1:
The anode acts as an intermediary structure between the bubble generation source and the barrier membrane. By fixing the membrane to the anode surface and providing through-holes in the anode, the design creates a controlled path for bubbles to pass through without accumulating on the membrane.
Solution Approach 2:
The anode incorporates through-holes that function as a porous structure, allowing bubbles to pass through while maintaining the structural integrity needed to support the barrier membrane and enable chamber separation.
4Object-generated harmful factors
If the anode is provided with through holes for bubble discharge, then bubbles can be removed from the plating solution, but the structural integrity of the anode may be compromised
Solution Approach 1:
The anode is segmented with multiple small through-holes distributed across its surface. This segmentation allows effective bubble removal through numerous small channels while maintaining the overall structural integrity of the anode body.
Solution Approach 2:
The through-holes create a porous structure in the anode that is optimized for bubble discharge. The porous design allows sufficient bubble removal capability while maintaining the mechanical strength needed to support the barrier membrane and withstand plating process conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the plating process by preventing bubble accumulation on the ion conductive path, thereby enhancing the uniformity of the plating film thickness and maintaining stable ion conduction.
Implementation Method 1
bubbles of a gas such as oxygen generated at the anode
Implementation Method 2
a barrier membrane placed between the anode and the substrate holder to part inside of the plating tank into an anode chamber and a cathode chamber
Implementation Method 3
a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face
Data Source
AI summary
There is provided an apparatus for plating, comprising: a plating tank configured to store a plating solution therein; an anode placed in the plating tank and provided with a plurality of through holes; a substrate holder provided to hold a substrate to be opposed to the anode; a barrier membrane placed to be brought into close contact with a first face on a substrate side of the anode; and a rear face plate placed to be opposed to a second face of the anode that is on an opposite side to the first face and to be separated from the second face by a predetermined distance and configured to regulate an amount of bubbles generated from the anode and accumulated on the second face.