Plating Apparatus Agitating Member Reciprocation for Bubble Removal
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Solution Overview
Problem
Conventional plating apparatuses are inefficient in removing gas bubbles from the entire ionically resistive element, leading to potential attachment of bubbles to the element's peripheral edge, which can remain unremoved or take a long time to be removed.
Innovation Solution
The plating apparatus incorporates a driving mechanism that reciprocates an agitating member around multiple positions, including a reference position and positions close to the peripheral edge of the ionically resistive element, to generate sufficient turbulence and efficiently remove gas bubbles attached to the element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the agitating member is reciprocated with a standard stroke (peripheral edge just overlaps peripheral edge of ionically resistive element), then the plating solution is adequately agitated for metal ion homogenization, but gas bubbles attached to the peripheral edge portion of the ionically resistive element may not be removed
Solution Approach 1:
The bubble removal process is segmented into multiple operational phases: a first reciprocation operation with a first stroke for general agitation, and a second reciprocation operation with a second stroke specifically targeting peripheral edge portions of the ionically resistive element. This segmentation allows different regions of the ionically resistive element to be addressed by optimized agitation patterns, ensuring complete bubble removal from both central and peripheral areas.
Solution Approach 2:
The agitation system dynamically adjusts the reciprocation stroke length and pattern based on the specific region being treated. The driving mechanism can vary the stroke between the first and second operations, creating different turbulence intensities and flow patterns appropriate for removing bubbles from different locations on the ionically resistive element, thereby improving overall removal efficiency.
2Area of stationary object
If the agitating member is reciprocated with a longer stroke to reach peripheral edge portions, then broader coverage is achieved, but sufficient turbulence may not be generated to remove gas bubbles efficiently
Solution Approach 1:
The agitation process is divided into distinct phases with different stroke characteristics. The first reciprocation operation covers the central region with adequate turbulence, while the second reciprocation operation extends to peripheral regions. Each phase is optimized for its specific region, ensuring that both coverage and turbulence intensity are sufficient for effective bubble removal across the entire ionically resistive element.
Solution Approach 2:
Different regions of the ionically resistive element receive customized agitation treatment. The central portion is treated with the first stroke pattern, while the peripheral edge portions receive the second stroke pattern. This local quality approach ensures that each region gets the appropriate level and type of agitation needed for effective bubble removal, rather than applying a uniform stroke throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables intensive and efficient removal of gas bubbles from the entire ionically resistive element, preventing bubble attachment and reducing the time required for bubble removal, thus improving the plating process efficiency.
Implementation Method 1
it is also considered that it is used to remove the gas bubbles attached to the ionically resistive element... the long stroke may not cause sufficient turbulence to remove the gas bubbles
Implementation Method 2
The cup-type electroplating apparatus deposits a conductive film on a surface to be plated of a substrate (for example, a semiconductor wafer) by immersing the substrate with the surface to be plated facing downward in a plating solution and applying a voltage between the substrate and an anode
Data Source
AI summary
To efficiently remove gas bubbles from an entire ionically resistive element. A plating apparatus includes a plating tank (410), a substrate holder (440), an anode (430), an ionically resistive element (450), an agitating member (480), and a driving mechanism (482). The plating tank (410) is configured to contain a plating solution. The substrate holder (440) is configured to hold a substrate (Wf) with a surface to be plated facing downward. The anode (430) is disposed in the plating tank (410). The ionically resistive element (450) is disposed between the substrate (Wf) and the anode (430). The agitating member (480) is disposed between the substrate (Wf) and the ionically resistive element (450). The driving mechanism (482) is configured to reciprocate the agitating member (480) along the surface to be plated of the substrate (Wf). The driving mechanism (482) is configured to perform a first gas-bubble removal operation to reciprocate the agitating member (480) around a first position and a second gas-bubble removal operation to reciprocate the agitating member (480) around a second position different from the first position, during a bubble removing process for removing gas bubbles attached to the ionically resistive element (450).