Plating Apparatus Liquid Level Fluctuation Reducing Member
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Solution Overview
Problem
High-speed operation of the paddle in electroplating apparatuses leads to intensified fluctuation of the liquid level of the plating solution, causing it to jump out of the bath and resulting in solution loss and increased cleaning time and labor.
Innovation Solution
A liquid level fluctuation reducing member with a flow path is introduced in the plating bath to increase the flow velocity of the plating solution, attenuating the energy of waves formed by the solution and reducing liquid level fluctuations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the paddle moving speed is increased to promote ion supply and enhance plating quality, then the plating speed and quality are improved, but the liquid level fluctuation intensifies causing plating solution to jump out of the bath
Solution Approach 1:
A liquid level fluctuation reducing member is introduced as an intermediary element in the plating bath. This member has a flow path through which plating solution passes, and it increases the flow velocity of the plating solution to attenuate the energy of waves formed by the plating solution, thereby reducing liquid level fluctuation while allowing high-speed paddle operation
Solution Approach 2:
The liquid level fluctuation reducing member changes the flow parameters of the plating solution by increasing its flow velocity through the flow path. This parameter change allows the system to dissipate wave energy more effectively, reducing liquid level fluctuation even when the paddle operates at high speed for improved productivity
2Manufacturing precision
If the paddle moving speed is increased to enhance plating quality, then the ion supply to substrate surface is improved, but plating solution loss occurs due to jumping out of the bath
Solution Approach 1:
The liquid level fluctuation reducing member serves as a mediator that allows high-speed paddle operation (necessary for high plating quality) without causing plating solution to jump out of the bath. By increasing flow velocity through its flow path, it attenuates wave energy and prevents solution loss while maintaining the high-quality plating process
3Productivity
If the paddle moving speed is increased to promote ion supply, then plating efficiency is improved, but cleaning time and labor increase due to solution adhering to apparatus parts
Solution Approach 1:
The liquid level fluctuation reducing member acts as a mediator that enables high-efficiency plating through high-speed paddle operation while simultaneously preventing plating solution from splashing onto surrounding apparatus parts. This elimination of splashing reduces the cleaning time and labor required after plating operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes liquid level fluctuations, preventing solution loss and reducing the time and effort required for cleaning the apparatus.
Implementation Method 1
increase a flow velocity of the plating solution passing through the flow path
Implementation Method 2
attenuate energy of waves formed by the plating solution
Data Source
AI summary
To reduce fluctuation of the liquid level of plating solution caused by the operation of a paddle. A plating apparatus for plating a substrate is provided. The plating apparatus includes: a plating bath configured to store plating solution; a paddle that is arranged in the plating bath and configured to stir the plating solution; and a liquid level fluctuation reducing member that is arranged in the plating bath, has a flow path through which the plating solution passes, and is configured to increase a flow velocity of the plating solution passing through the flow path to attenuate energy of waves formed by the plating solution.