Stacked Plating Apparatus with Observation Window
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Solution Overview
Problem
Existing plating apparatuses are complex and large in size, increasing manufacturing and material costs, and lack the ability to observe the production process of plated objects during plating, which is necessary for high-performance applications like semiconductor wiring.
Innovation Solution
A simplified plating apparatus with a stacked structure comprising a holding member, spacer, and anode member, where the spacer has a through portion for exposing the plated object and storing plating solution, allowing for easy adjustment of the cathode-anode distance and inclusion of a light-transmissive window for observation, enabling the use of high-performance microscopes during plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a tank with openings and grooves is used to accommodate cathode and anode plates, then the plating apparatus can perform electroplating, but the structure becomes larger and more complex, increasing manufacturing and material costs
Solution Approach 1:
The plating apparatus is divided into separate functional modules: a cathode module holding the plated object, an anode module with the anode plate, and a spacer module with grooves. These modules are positioned facing each other without requiring a complex tank structure with multiple openings and grooves, thereby simplifying the overall device while maintaining plating functionality
Solution Approach 2:
The essential plating function is extracted from the complex tank structure. By using separate cathode and anode modules that can be positioned independently, the invention eliminates the need for a tank with multiple openings and grooves, reducing structural complexity and manufacturing costs while preserving the core electroplating capability
2Productivity
If a tank with openings and grooves is used to accommodate cathode and anode plates, then the plating apparatus can perform electroplating, but the apparatus becomes larger in size
Solution Approach 1:
The apparatus is segmented into compact modular units (cathode module, anode module, spacer) that can be closely positioned, reducing the overall apparatus volume while maintaining the necessary plating functionality through the modular arrangement
Solution Approach 2:
The modular design allows components to be nested or closely integrated, with the spacer module containing grooves that hold the anode module in position, creating a compact configuration that minimizes apparatus size while preserving plating capability
3Productivity
If a conventional plating apparatus structure is used, then electroplating can be performed, but observation of the production process during plating is not possible
Solution Approach 1:
The anode module includes a light-transmissive window that provides a localized observation path through the plating solution. This local modification allows optical access for microscopy and monitoring without requiring changes to the overall plating structure or interrupting the plating process
Solution Approach 2:
The light-transmissive window acts as an intermediary that allows optical signals to pass through the plating solution and reach the plated object. This intermediary structure enables the use of high-performance microscopes and observation tools during plating without interfering with the electroplating process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus is more compact, cost-effective, and allows for real-time observation of the plating process, reducing manufacturing costs and enhancing the ability to monitor the production process with high-performance tools like Raman microscopes.
Implementation Method 1
a plating apparatus for applying electrolytic plating or electroless plating on the face of a plated object
Implementation Method 2
electrolytic plating
Data Source
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AI summary
A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a through portion (45) from which the plated object (W) is exposed and which stores a plating solution; and an anode member (6) that is stacked on the spacer (4) via a second seal member (3) in an annular shape surrounding the through portion (45), and has an anode layer (62) arranged to face the plated object (W) which is exposed from the through portion (45).