Plating Bath E-Duct Layout for Uniform Coating and Gloss Control
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Solution Overview
Problem
Existing plating devices face challenges in achieving uniform plating quality and preventing gloss deterioration, particularly for objects with varying thicknesses and aspect ratios, while also optimizing space utilization and production efficiency.
Innovation Solution
A plating device that moves objects in multiple directions and uses nozzles with varying apertures and intensities, combined with a shield to control metal ion flow, ensuring even e-duct influence and preventing excessive plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional vertical continuous plating device is used to improve plating quality, then plating gloss and brightness are improved, but installation area increases and production volume decreases
Solution Approach 1:
The e-duct is divided into multiple independent nozzle groups that can be independently controlled and positioned. Each nozzle group can be selectively activated and moved to different locations, allowing the system to process multiple substrates in parallel while maintaining the high plating quality of vertical continuous plating
Solution Approach 2:
The e-duct nozzles are arranged in multiple vertical levels (height dimension) and can move horizontally (x-axis and y-axis). This multi-dimensional arrangement allows simultaneous treatment of multiple substrates at different positions, increasing production volume while maintaining uniform e-duct influence on each substrate
2Manufacturing precision
If the e-duct affects all areas of the substrate to improve plating uniformity, then hole plating uniformity is improved, but excessive plating occurs at edges causing gloss deterioration
Solution Approach 1:
The e-duct system uses nozzles with different aperture sizes arranged in specific patterns, and selectively activates only the nozzles needed for each substrate's hole plating area. The shield structure locally blocks metal ion flow to edge areas, ensuring uniform hole plating while preventing excessive edge plating that would cause gloss deterioration
Solution Approach 2:
A shield structure is introduced as an intermediary element between the e-duct and the substrate edges. The shield blocks excessive metal ion flow to the edge areas, mediating between the need for uniform hole plating and the need to prevent gloss deterioration from excessive edge plating
3Productivity
If multiple plating devices are installed to increase production volume, then productivity is improved, but space utilization decreases
Solution Approach 1:
Multiple plating functions are merged into a single integrated device. The system combines multiple nozzle groups, substrate mounting bars, and e-duct structures into one platform that can process multiple substrates simultaneously, achieving the production volume of multiple devices while using the space of one device
Solution Approach 2:
The e-duct system is designed with universal, multi-functional capabilities. The same e-duct structure with movable nozzles can serve multiple substrates of different sizes and configurations, replacing the need for separate specialized plating devices and maximizing space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves plating quality and manufacturing yield by evenly applying e-duct pressure, reduces gloss deterioration, and increases space utilization for multi-variety and mass production.
Implementation Method 1
an e-duct which is moved in the left/right direction, uses nozzles having different injection apertures and injection intensities alternatively arranged with each other, to inject the plating solution discharged from the circulation pump into the plating bath under high pressure
Implementation Method 2
the e-duct being connected to a circulation pump that sucks in and discharges the plating solution in the plating bath through a connection tube so as to inject the plating solution discharged from the circulation pump into the plating bath under high pressure
Implementation Method 3
where copper (Cu), gold (Au), nickel (Ni) or the like is electroplated on the to-be-plated object within in the plating bath
Data Source
Figure 1(a)~2
Figure 3~4(b)
Figure 5~6
AI summary
The present invention relates to a plating device for improving plating quality and preventing gloss deterioration of an object to be plated. An object of the present invention is to improve both plating quality and manufacturing yield of a vertical continuous plating bath or a general dip-type plating bath. In an embodiment, the present invention provides a plating device for improving plating quality and preventing gloss deterioration of an object to be plated, wherein the plating device includes a plating bath, an e-duct, a substrate mounting bar, and a mounting bar moving unit. Thus, the inventive plating device injects pressure through the e-duct while moving the to-be-plated object in the forward/rearward, left/right, and upward/downward directions within the plating bath, so that the influence of the e-duct can be evenly applied to to-be-plated objects with different aspect ratios and thicknesses.