Plating Bath E-Duct Motion for Uniform Coating and Edge Gloss
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Solution Overview
Problem
Existing plating devices face challenges in achieving uniform plating quality and preventing gloss deterioration, particularly for objects with varying aspect ratios and thicknesses, while also optimizing space utilization and production efficiency.
Innovation Solution
A plating device that moves objects in x, y, and z directions using e-ducts with varying nozzle apertures and intensities, combined with a shield to control metal ion flow and prevent excessive plating, allowing even application of pressure and improving plating quality and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a general plating device is used, then space utilization is improved and multiple plating devices can be installed, but plating quality such as gloss uniformity and hole plating uniformity deteriorates
Solution Approach 1:
The e-duct is divided into multiple independent nozzle units that can be individually controlled. Each nozzle can be independently adjusted to optimize plating uniformity across different areas of the substrate, resolving the contradiction between space utilization and plating quality by enabling precise local control within a compact device footprint.
Solution Approach 2:
The e-duct is designed with movable and adjustable components, including nozzles that can be repositioned and rotated. This dynamic capability allows the device to adapt to different plating requirements and substrate configurations, maintaining high plating quality while optimizing space utilization through flexible positioning.
2Manufacturing precision
If the e-duct is moved in the x-axis direction, then the influence of the e-duct can be evenly applied to objects with different aspect ratios and thicknesses, but the device complexity increases
Solution Approach 1:
The e-duct assembly is designed to perform multiple functions: it can move in the x-axis direction to accommodate different object dimensions, adjust nozzle positions to target specific areas, and rotate to optimize injection angles. This multi-functionality enables a single device structure to handle various plating scenarios without requiring multiple specialized components.
Solution Approach 2:
The system incorporates automated control mechanisms that enable the e-duct to self-adjust its position and orientation based on the detected object characteristics. This self-service capability reduces the need for complex manual intervention and simplifies the overall device structure while maintaining plating uniformity across diverse objects.
3Manufacturing precision
If a shield is installed to control metal ion flow and prevent excessive plating, then gloss deterioration is prevented, but the device complexity increases
Solution Approach 1:
A shield component is introduced as an intermediary element between the e-duct and the substrate. This shield controls the flow of metal ions by blocking excessive plating in specific areas, thereby preventing gloss deterioration. The shield acts as a mediator that regulates the plating process without requiring fundamental changes to the core e-duct mechanism.
Solution Approach 2:
The shield is designed to provide localized control over metal ion flow, allowing different regions of the substrate to receive appropriate plating coverage. By applying protection only where excessive plating occurs, the shield maintains gloss quality without requiring comprehensive system redesign, thus limiting the increase in device complexity to specific targeted areas.
4Productivity
If multiple plating lines are installed to increase production volume, then productivity is improved, but the installation area increases
Solution Approach 1:
Multiple plating lines are merged into a single integrated device structure. The e-duct system can serve multiple substrates simultaneously through its ability to move and adjust nozzle positions, effectively combining the functionality of multiple independent plating devices into one compact unit. This merging approach increases production volume without proportionally increasing installation area.
Solution Approach 2:
The device utilizes three-dimensional movement capabilities, particularly x-axis movement, to enable a single plating line to service multiple substrates arranged in different spatial configurations. By exploiting the vertical and horizontal dimensions, the system achieves multi-line productivity within a compact footprint, effectively adding production capacity without expanding the installation area proportionally.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances plating quality and manufacturing yield by evenly applying e-duct influence across objects with different dimensions, preventing edge gloss deterioration, and increasing space utilization for multiple plating lines.
Implementation Method 1
an e-duct configured to be supported at its upper end by an e-duct support and mounted on the inner sidewalls of the plating bath so as to be movable horizontally, the e-duct being connected to a circulation pump that sucks in and discharges the plating solution in the plating bath through a connection tube so as to inject the plating solution discharged from the circulation pump into the plating bath under high pressure
Implementation Method 2
a circulation pump that sucks in and discharges the plating solution in the plating bath through a connection tube so as to inject the plating solution discharged from the circulation pump into the plating bath under high pressure
Implementation Method 3
a substrate mounting bar disposed at the upper portion of the plating bath so as to be movable in the left/right and forward/rearward directions of the plating bath, and configured to grip an object to be plated to allow the object to be moved and electrically conducted in the left/right and forward/rearward directions within the plating bath
Implementation Method 4
a mounting bar moving unit disposed on an upper portion of the substrate mounting bar, and configured to independently move the substrate mounting bar in the left/right and forward/rearward directions of the plating bath so as to adjust the position of the to-be-plated object within the plating bath or the separation distance between the e-duct and the to-be-plated object
Implementation Method 5
a shield disposed in front of the e-duct so as to be spaced apart from the e-duct inwardly from the inner sidewalls of the plating bath in such a manner as to be positioned beyond the size of the to-be-plated object, the shield being configured to block the migration of metal irons caused by the e-duct at the position beyond the size of the to-be-plated object to prevent excessive plating at the edge of the to-be-plated object
Implementation Method 6
where copper (Cu), gold (Au), nickel (Ni) or the like is electroplated on the to-be-plated object within in the plating bath
Data Source
AI summary
The present invention relates to a plating device for improving plating quality and preventing gloss deterioration of an object to be plated. An object of the present invention is to improve both plating quality and manufacturing yield of a vertical continuous plating bath or a general dip-type plating bath. In an embodiment, the present invention provides a plating device for improving plating quality and preventing gloss deterioration of an object to be plated, wherein the plating device includes a plating bath, an e-duct, a substrate mounting bar, and a mounting bar moving unit. Thus, the inventive plating device injects pressure through the e-duct while moving the to-be-plated object in the forward/rearward, left/right, and upward/downward directions within the plating bath, so that the influence of the e-duct can be evenly applied to to-be-plated objects with different aspect ratios and thicknesses.