Rotating Plating Contact Cleaning With Lower-Side Fluid Flow
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Solution Overview
Problem
The existing plating apparatuses have a complex structure for cleaning the contact member due to the use of brushes and cleaning liquids, which complicates the cleaning process.
Innovation Solution
A plating apparatus with a contact cleaning member that discharges cleaning liquid toward the contact member from the lower side of the substrate holder, simplifying the cleaning process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a brush and cleaning liquid are used to clean the contact member, then the contact member can be cleaned effectively, but the cleaning device structure becomes complicated
Solution Approach 1:
The patent replaces the mechanical brush cleaning system with a liquid-based cleaning system. A cleaning liquid supply unit delivers cleaning liquid to the contact member, and the substrate holder's rotation creates fluid dynamics that enable effective cleaning without mechanical brushes, thereby simplifying the device structure while maintaining cleaning effectiveness
Solution Approach 2:
The patent uses hydraulic principles by supplying cleaning liquid through a cleaning liquid supply unit. The cleaning liquid flows over the contact member during substrate holder rotation, using fluid dynamics to achieve cleaning效果 without complex mechanical components, thus resolving the contradiction between cleaning effectiveness and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified structure effectively cleans the contact member, reducing the complexity and improving efficiency in the cleaning process.
Implementation Method 1
a contact cleaning member for discharging a cleaning liquid toward the main body of the contact member from a lower side of the substrate holder
Implementation Method 2
a rotation mechanism configured to rotate the substrate holder
Implementation Method 3
The cup type electroplating apparatus deposits a conductive film on a surface of a substrate (for example, a semiconductor wafer) by immersing the substrate held by a substrate holder with a surface to be plated facing downward in a plating solution and applying a voltage between the substrate and an anode
Data Source
AI summary
A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.