Plating Contact Member Cleaning for Stable Power Supply
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Solution Overview
Problem
Power supply variations occur during the plating process due to dirt on the contact member or adherence of plating solution, leading to non-uniform thickness of the formed plating, and existing solutions require complicated work to mitigate these issues.
Innovation Solution
A plating method involving tilting and rotating the substrate holder at specific speeds, discharging liquid to coat the contact member, and adjusting the holder's tilt and rotation to ensure uniform coating without complex operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the contact member is uniformly wetted with cleaning solution, then power supply variation is reduced, but the process becomes more complicated
Solution Approach 1:
The substrate holder is tilted and rotated dynamically during the cleaning process, transforming a static uniform wetting problem into a dynamic coating process. The rotation speed and tilt angle are controlled to ensure the cleaning solution uniformly coats the contact member surface through gravitational and centrifugal forces, eliminating the need for complex multi-step cleaning procedures
Solution Approach 2:
The invention changes physical parameters (tilt angle, rotation speed) to control the cleaning solution's behavior. By adjusting these parameters, the solution flows uniformly across the contact member surface, achieving reliable power supply stability without complicating the process
2Reliability
If dirt is present on contact member or plating solution adheres, then power supply variation occurs, but cleaning requires complicated work
Solution Approach 1:
The cleaning process uses the substrate holder's own motion (tilting and rotating) to distribute the cleaning solution uniformly. The system serves itself by utilizing the existing mechanical movement for cleaning purposes, eliminating the need for separate complex cleaning mechanisms or procedures
3Reliability
If cleaning solution is applied to contact member, then power supply variation is reduced, but plating solution adherence increases
Solution Approach 1:
The cleaning solution is applied before the plating process, and the substrate holder is tilted and rotated to ensure the cleaning solution is removed or dried before plating begins. This preliminary cleaning action prevents plating solution adherence that would cause power supply variation, while the rapid transition to plating minimizes any potential harmful effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces power supply variations and enhances the uniformity of plating thickness on substrates without requiring intricate procedures.
Implementation Method 1
tilting the substrate holder, rotating the substrate holder at a first rotation speed while the substrate holder is tilted
Implementation Method 2
rotating the substrate holder at a first rotation speed while the substrate holder is tilted
Implementation Method 3
performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member
Implementation Method 4
a voltage is applied between the substrate and an anode, thereby precipitating an electrically conductive film on a substrate surface
Implementation Method 5
cup type electrolytically plating apparatus
Data Source
AI summary
A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.