Leakage Detection in Plating Apparatus Contact Members
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The leakage of plating solution to the contact member in a cup type electroplating apparatus can cause variations in electrical resistance, affecting the homogenization of the plating process, and there is a need for a method to determine the presence or absence of such leakage.
Innovation Solution
A leakage determination method involving a discharging step to clean the contact member, a measuring step to assess the conductivity of the cleaning liquid, and a determining step to compare the conductivity with a reference to identify any leakage, using a plating apparatus with a substrate holder, contact cleaning member, and electrical conductivity meter.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate holder includes a sealing member to prevent plating solution from entering the contact member region, then the reliability of the plating process is improved, but the plating solution may still leak through gaps between the sealing member and substrate, causing electrical resistance variations
Solution Approach 1:
The patent applies preliminary action by performing a cleaning process on the contact member before the actual plating measurement. The cleaning liquid is discharged to the contact member to remove any leaked plating solution, and then the conductivity of the cleaning liquid is measured. This preliminary cleaning action ensures that the subsequent plating process starts with a clean contact member, preventing electrical resistance variations caused by plating solution leakage.
Solution Approach 2:
The patent implements feedback by measuring the conductivity of the cleaning liquid after cleaning the contact member. The cleaning liquid conductivity measurement provides feedback information about whether plating solution leakage occurred during the previous plating process. This feedback mechanism allows for real-time monitoring and quality control of the plating process homogenization.
2Reliability
If the contact member is cleaned after each plating process to remove plating solution, then electrical resistance stability is improved, but the cleaning process requires additional time and complexity
Solution Approach 1:
The patent replaces complex mechanical cleaning systems with a simpler fluid-based cleaning approach. Instead of using mechanical brushes or scrapers to clean the contact member, the system uses a cleaning liquid discharge mechanism that flows cleaning liquid over the contact member. This substitution reduces device complexity while effectively removing plating solution residues.
Solution Approach 2:
The patent applies hydraulics by using a cleaning liquid flow system to clean the contact member. The cleaning liquid is discharged through nozzles or channels that direct the fluid onto the contact member surface, utilizing fluid dynamics to remove contaminants. This hydraulic cleaning approach is simpler and more effective than mechanical cleaning methods.
3Measurement precision
If the conductivity of cleaning liquid is measured after each plating process to detect leakage, then measurement precision for leakage detection is improved, but the overall process time increases
Solution Approach 1:
The patent applies partial action by measuring the conductivity of the cleaning liquid at a specific point in the cleaning process, rather than continuously monitoring throughout the entire cleaning cycle. The conductivity measurement is performed after the cleaning liquid has had sufficient time to contact and remove plating solution residues from the contact member. This partial measurement approach provides adequate leakage detection accuracy without requiring excessive measurement time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively determines the presence of plating solution leakage, allowing for timely inspection and maintenance of the substrate holder, thereby reducing electrical resistance variations and improving the homogenization of the plating process.
Implementation Method 1
measuring a conductivity of the cleaning liquid after cleaning the contact member
Data Source
AI summary
Provided is a technique that determines presence of a leakage of a plating solution to an arranged region of a contact member.A leakage determination method includes: discharging step 120 of discharging a cleaning liquid to the contact member of a substrate holder after immersing a substrate held by the substrate holder in the plating solution and performing a plating process; a measuring step 122 of measuring a conductivity of the cleaning liquid after cleaning the contact member; and determining step 128 of determining presence or absence of a leakage of the plating solution to the arranged region of the contact member based on comparison between a first conductivity of a cleaning liquid measured in advance for a substrate holder serving as a reference and a second conductivity of the cleaning liquid measured in the measuring step 122.