Plating Apparatus Current Density Estimation Film Thickness Flatness
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Solution Overview
Problem
In plating apparatuses, achieving high film thickness flatness on substrates is challenging due to various control parameters affecting film thickness distribution, and existing methods lack effective means to determine optimal control parameters for uniform plating.
Innovation Solution
A plating apparatus equipped with a potential sensor, estimation unit, current density calculation unit, film thickness calculation unit, and control parameter determination unit, which together measure and calculate current density and film thickness, and determine optimal control parameters for each operation mode to achieve uniform plating, utilizing a state space model and Kalman filter for accurate estimation and correction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple control parameters are used to adjust plating process, then film thickness flatness can be improved, but determining optimal parameters becomes complex and time-consuming
Solution Approach 1:
The system measures actual potential distribution during plating and feeds this information back to the control unit, which compares measured values with target values and automatically adjusts control parameters to maintain optimal film thickness flatness
Solution Approach 2:
The system dynamically changes control parameters (current density, rotation speed, shielding position) based on real-time potential measurements to optimize film thickness distribution across different substrate regions
2Manufacturing precision
If real-time measurement and adjustment is implemented, then plating uniformity is improved, but system complexity and cost increase
Solution Approach 1:
The system replaces complex mechanical adjustment mechanisms with electronic sensing and control, using potential sensors and automated control algorithms to achieve precise plating uniformity without extensive mechanical complexity
Solution Approach 2:
The system performs self-adjustment by automatically comparing measured potential distribution with target values and correcting control parameters without requiring external intervention or complex operator decisions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures high film thickness flatness by determining optimal control parameters, improving the uniformity and quality of the plating process through real-time measurement and adjustment of current density and film thickness.
Implementation Method 1
a potential sensor disposed in the vicinity of the substrate held by the substrate holder and configured to measure a potential of the plating solution
Implementation Method 2
a plating tank in which a plating solution is stored... an anode disposed in the plating tank to oppose the substrate held by the substrate holder... a density of a plating current flowing through the plating solution into the substrate
Implementation Method 3
a density of a plating current flowing through the plating solution into the substrate
Data Source
AI summary
Provided is a plating apparatus to determine appropriate control parameters for forming plating with high film thickness flatness on a substrate. The plating apparatus includes an estimation unit that estimates a density of a current flowing through an outer edge of the substrate, a current density calculation unit that calculates a density of a plating current flowing through a plating solution into the substrate based on the estimated current density, and a control parameter that specifies an operation mode of the plating apparatus, the current density calculation unit calculating the plating current density for each of a plurality of different operation modes of the plating apparatus, a film thickness calculation unit that calculates a thickness of a plating film formed on the substrate for each of the plurality of operation modes, based on each calculated plating current density, and a control parameter determination unit that determines a control parameter corresponding to an optimal operation mode, based on the calculated plating film thickness for each operation mode of the plating apparatus.