Plating Apparatus Film Thickness Measurement via Induction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plating apparatuses are not capable of measuring the film thickness of substrates during the plating process.
Innovation Solution
A plating apparatus equipped with a plating tank, substrate holder, rotation mechanism, contact members, coil, and current sensor, which generates a current through electromagnetic induction to detect the film thickness of the substrate, allowing for real-time measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a conventional plating apparatus is used, then the plating process can be performed, but the film thickness of the substrate cannot be measured
Solution Approach 1:
The patent combines the film thickness measurement function with the existing plating apparatus by integrating a coil and detection system into the substrate holder. The coil is disposed in the substrate holder to generate electromagnetic induction signals, allowing film thickness measurement to be performed simultaneously with the plating process without requiring a separate measurement device.
Solution Approach 2:
The substrate holder is designed to serve multiple functions: it not only holds and rotates the substrate during plating but also contains the coil for generating electromagnetic induction signals and supports contact members for electrical connection. This multi-functional design enables both plating and film thickness measurement capabilities within a single component.
2Productivity
If contact members are added to supply electricity to the substrate, then the plating process can be performed, but the device complexity increases
Solution Approach 1:
The patent merges the electrical supply function with the measurement function by integrating contact members into the substrate holder structure. The contact members are disposed in the substrate holder to supply electricity to the substrate, and their positioning is coordinated with the coil arrangement to enable both plating and electromagnetic induction-based measurement without requiring separate electrical supply systems.
3Measurement precision
If the coil is disposed close to the substrate holder for electromagnetic induction, then the measurement sensitivity increases, but the device complexity and space requirements increase
Solution Approach 1:
The patent utilizes the radial dimension of the substrate holder for coil placement. The coil is disposed in the substrate holder in a radial direction, allowing it to be positioned close to the substrate for effective electromagnetic induction while efficiently utilizing the available radial space rather than requiring additional axial or circumferential space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of the film thickness of substrates during the plating process and provides a distribution of film thickness in the circumferential direction.
Implementation Method 1
The coil is configured to generate a current by an electromagnetic induction due to a magnetic field caused by a current flowing into the contact member
Implementation Method 2
The current sensor is configured to detect the current generated in the coil
Data Source
AI summary
Provided is a technique that allows measuring a film thickness of a substrate in a plating process.A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.