Plating Apparatus Real-Time Film Thickness Control
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Solution Overview
Problem
In plating apparatuses, variations in film thickness of the plating film on substrates occur due to dimensional tolerances and changes in the plating solution, leading to non-uniformity, especially when multiple substrates are treated under the same conditions.
Innovation Solution
A plating apparatus equipped with a film thickness measuring module using sensors to detect the plating film thickness in real-time during treatment, allowing for adjustments to plating conditions such as current, time, anode mask opening, and shielding body position to ensure uniform film deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are subjected to plating treatment under the same conditions, then productivity is improved, but film thickness uniformity deteriorates due to dimensional tolerances and plating solution changes
Solution Approach 1:
The patent implements real-time film thickness measurement during plating treatment using sensors (such as white confocal sensors) that detect plating film thickness continuously. The measured values are fed back to the control unit, which adjusts plating parameters (current density, time, temperature) dynamically to maintain uniform film thickness across multiple substrates, resolving the contradiction between processing multiple substrates and maintaining precision.
Solution Approach 2:
The system dynamically adjusts plating parameters (current density, plating time, temperature, agitation speed) based on real-time film thickness measurements and substrate position. By changing these parameters adaptively during the plating process, the system maintains uniformity despite variations in substrate dimensions and plating solution conditions, enabling high throughput without sacrificing quality.
2Manufacturing precision
If real-time film thickness measurement is implemented during plating treatment, then film thickness uniformity is improved, but device complexity increases due to additional sensors and control systems
Solution Approach 1:
The patent replaces traditional mechanical measurement methods (requiring substrate removal and physical contact) with optical sensing technologies (white confocal sensors) that can measure film thickness non-contactingly during plating. This substitution reduces mechanical complexity while enabling real-time monitoring, as the optical sensors can detect thickness changes through light reflection without interfering with the plating process.
Solution Approach 2:
The control unit serves multiple functions: it controls plating current, monitors film thickness via sensors, adjusts process parameters, and maintains uniformity across substrates. By making the control system multi-functional, the patent reduces overall device complexity compared to having separate dedicated systems for each function, while still achieving real-time precise control.
3Device complexity
If film thickness is measured after plating treatment using separate measuring devices, then device complexity is minimized, but measurement time increases and productivity decreases
Solution Approach 1:
The patent merges the film thickness measurement function with the plating treatment process by using sensors integrated into the plating chamber. This allows measurement and plating to occur simultaneously, eliminating the need for separate measurement steps after treatment. The combined operation reduces total process time and increases productivity while maintaining measurement accuracy through continuous monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables real-time monitoring and adjustment of plating conditions, significantly improving the uniformity of the plating film across substrates by addressing variations in film thickness and location-specific deposition.
Implementation Method 1
a voltage is applied between the substrate and an anode, thereby precipitating a conductive film on a substrate surface
Implementation Method 2
a voltage is applied between the substrate and an anode, thereby precipitating a conductive film on a substrate surface
Data Source
AI summary
An objective of the present invention is to provide a plating apparatus capable of improving uniformity of a plating film formed on a substrate. The plating apparatus includes a plating tank, a substrate holder that holds a substrate, an anode disposed, in the plating tank, facing the substrate held by the substrate holder, and a film thickness measuring module including a sensor that detects a parameter related to a plating film formed on a surface to be plated of the substrate, the film thickness measuring module measuring a film thickness of the plating film based on a detection value of the sensor during a plating treatment.