Numerical Plating Analysis for Terminal Effect Compensation
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Solution Overview
Problem
Current methods for optimizing electroplating conditions fail to accurately analyze and reproduce the film thickness distribution on pattern substrates due to the terminal effect, leading to non-uniformity and requiring costly and time-consuming experimental processes.
Innovation Solution
A numerical analysis method that involves electrochemical measurements to derive parameters for calculating current density distribution on a substrate, represented by a function formula that accounts for position-dependent terminal effects, allowing for precise calculation of film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If numerical analysis simulation is used to optimize plating conditions, then cost and time required for optimization are reduced, but accurate analysis of film thickness distribution considering terminal effect is not achieved
Solution Approach 1:
The patent changes the parameters of the numerical analysis by incorporating terminal effect parameters (electric resistance values of seed layer and plating solution) into the simulation model. This allows the simulation to accurately reproduce the non-uniform current density distribution caused by terminal effect, thereby achieving precise prediction of film thickness distribution while maintaining the efficiency of numerical simulation.
Solution Approach 2:
The patent creates a virtual copy of the actual plating process through numerical simulation that incorporates terminal effect. By modeling the electric resistance values and current density distribution in the simulation environment, the system reproduces the actual plating conditions and outcomes without requiring physical experiments, thus achieving both accuracy and efficiency.
2Manufacturing precision
If pattern substrates with resist are used for optimization, then accurate plating conditions for actual product are obtained, but cost increases significantly
Solution Approach 1:
The patent uses numerical simulation to create a virtual model that copies the behavior of actual pattern substrates during plating. By inputting parameters such as electric resistance values and geometric configurations, the simulation predicts film thickness distribution and plating conditions without consuming physical pattern substrates with resist, thereby eliminating the high cost associated with manufacturing and testing multiple physical samples.
Solution Approach 2:
The patent replaces the physical mechanical system of using actual pattern substrates with resist for optimization with a computational numerical analysis system. This substitution eliminates the need for costly physical materials while providing accurate predictions through mathematical modeling of the electroplating process including terminal effect.
3Reliability
If electric contact is provided at peripheral part of substrate, then electrical connection is achieved, but terminal effect causes non-uniform current distribution and reduced plating uniformity
Solution Approach 1:
The patent applies local quality by considering the spatial variation of electric resistance in different regions of the substrate. The numerical analysis divides the substrate into multiple regions with different electric resistance characteristics, particularly accounting for the higher resistance in the seed layer and plating solution at the center region compared to the peripheral region with electric contact. This localized parameter assignment enables accurate prediction of the non-uniform current density distribution and film thickness caused by terminal effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate and efficient calculation of film thickness distribution on pattern substrates, reducing costs and time by simulating the terminal effect, thus optimizing plating conditions without the need for extensive experimental processes.
Implementation Method 1
performing electrochemical measurement in an electroplating apparatus; deriving electrochemical parameters from result of the electrochemical measurement
Implementation Method 2
based on the electrochemical parameters and the plating conditions, determining current density distribution on a surface of a substrate which is an object of the plating process
Implementation Method 3
current corresponding to combined resistance, which is formed by combining an electric resistance value of a plating solution and an electric resistance value of a part between a center part and the electric contact of the seed layer, flows in the center part of the substrate
Implementation Method 4
a plating film is grown on the seed layer... performing electrochemical measurement in an electroplating apparatus... calculating thickness of a film plated on the substrate
Data Source
AI summary
The present disclosure provides techniques for determining plating conditions by numerically analyzing a film-thickness distribution. The disclosed techniques comprise performing electrochemical measurement in an electroplating apparatus; determining electrochemical parameters based on a result of the electrochemical measurement; receiving initial plating conditions for performing a plating process; based on the electrochemical parameters and the initial plating conditions, determining a current density distribution on a surface of a substrate based on a function formula which comprises a variable which represents a position on the substrate; based on the current density distribution, calculating a thickness of a film to be plated on the substrate; and performing the plating process based on final plating conditions corresponding to a calculated film-thickness distribution satisfying a desired film-thickness distribution.