Plating Apparatus Flow Dynamics for Thickness Uniformity
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Solution Overview
Problem
Conventional injection plating apparatuses face issues with non-uniform plating thickness due to varying liquid feed areas on the plating object, leading to increased complexity and cost from the need for additional mechanisms like rotating cathode members and multiple nozzles.
Innovation Solution
A plating apparatus design where the plating liquid flows into a space between the anode and cathode from above and is sucked from below, enhancing flow rate and uniformity without requiring nozzles or a driving mechanism, thus simplifying and downsizing the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If injection plating is used to improve productivity and prevent plating defects, then plating productivity is improved and plating defects are prevented, but non-uniform plating thickness occurs due to varying liquid feed areas
Solution Approach 1:
The cathode member is rotated during the plating process to dynamically change the relative position between the plating object and the liquid feed area. This rotation ensures that all areas of the plating object receive uniform liquid supply over time, solving the non-uniform plating thickness problem while maintaining the high productivity benefits of injection plating
2Manufacturing precision
If nozzles and driving mechanism are added to improve plating thickness uniformity, then plating thickness uniformity is improved, but device complexity and size increase, resulting in higher costs
Solution Approach 1:
The cathode member serves dual functions: it acts as both the electroplating cathode electrode and the rotating mechanism to ensure uniform liquid distribution. By combining these functions into a single component, the invention achieves uniform plating thickness without requiring separate nozzles and driving mechanisms, thereby avoiding increased device complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves plating thickness uniformity, reduces costs by eliminating the need for additional mechanisms, and prevents plating defects by ensuring uniform liquid distribution and efficient liquid circulation.
Implementation Method 1
a pump arranged outside the space, the pump moving the plating liquid
Implementation Method 2
the plating liquid flows into the space from above relative to the space and is sucked by a pump from below relative to the space
Data Source
Figure 1
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Figure 3
AI summary
Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus (M) includes a plating tank (10) which stores a plating liquid (F), a cathode member (20) arranged inside the plating tank (10), a plating object (W) arranged inside the plating tank (10) to face the cathode member (20), an anode jig (30) which contacts with the plating object (W), and a space (40) formed between the cathode member (20) and the plating object (W) to be a flow passage to which the plating liquid (F) flows from the plating tank (10). The plating liquid (F) flows into the space (40) from above relative to the space (40), and is sucked by a pump (50) from below relative to the space (40).