Plating Apparatus Gas Flow and Suction for Particle Control
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Solution Overview
Problem
In dip electroplating processes, the formation of a uniform downward air flow is hindered by the processing bath, leading to particle contamination on substrates, and existing methods to remove processing liquid from substrate holders reduce throughput.
Innovation Solution
A plating apparatus with a gas flow generator to create a clean gas flow during substrate transport and a suction mechanism to remove processing liquid from the substrate holder, preventing particle attachment and maintaining throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a downward air flow is generated to prevent particle attachment, then substrate cleanliness is improved, but the processing bath obstructs the air flow path causing non-uniform flow and reduced effectiveness
Solution Approach 1:
The invention extracts the harmful factor (processing bath obstruction) by introducing a partition wall that separates the air flow path from the processing bath. This allows the downward air flow to be generated effectively without being blocked by the processing bath, thereby preventing particle attachment while maintaining uniform flow distribution.
Solution Approach 2:
The invention segments the clean room into distinct regions using partition walls. By dividing the space, the air flow path is isolated from the processing bath, enabling uniform downward air flow generation. This segmentation resolves the obstruction problem while maintaining the cleanliness function.
2Object-generated harmful factors
If the substrate holder is lifted at reduced speed to remove processing liquid, then liquid removal is improved, but throughput is reduced
Solution Approach 1:
The invention extracts the harmful factor (processing liquid) using a suction mechanism that actively removes liquid from the substrate holder. This allows the substrate holder to be lifted at normal speed without carrying excessive liquid, thereby preventing contamination while maintaining high throughput.
Solution Approach 2:
The invention uses a suction mechanism (pneumatic system) to remove processing liquid from the substrate holder. This active liquid removal method allows rapid lifting of the substrate holder without liquid spillage, resolving the contradiction between liquid removal effectiveness and throughput maintenance.
3Speed
If the substrate holder is transported with processing liquid remaining on it, then transport speed is maintained, but liquid may drop causing contamination
Solution Approach 1:
The invention applies preliminary action by using a suction mechanism to remove processing liquid from the substrate holder before transport begins. This ensures that the substrate holder is free of excess liquid when transported at high speed, preventing drop and contamination while maintaining transport speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The clean gas flow prevents particle attachment to the substrate, while the suction mechanism efficiently removes processing liquid without reducing the plating apparatus' throughput, enhancing both cleanliness and operational efficiency.
Implementation Method 1
a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported
Implementation Method 2
a suction mechanism configured to suck the processing liquid remaining on the substrate held by the substrate holder
Data Source
AI summary
A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.