Plating Hanger Shock-Absorbing Structure for Uniform Transfer

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Solution Overview

Problem

Conventional plating processes for printed circuit boards experience vibration and noise due to gear engagement, leading to non-uniform plating and frequent component failures, as the hanger and rail system transfers the board, causing shocks that affect adhesion and plating quality.

Innovation Solution

A plating hanger device with a shock-absorbing structure that uses an elastic spring to press a connection shaft, which in turn improves adhesion between the transfer housing and driving gear, reducing noise and shock through the elastic spring's absorption, ensuring uniform speed and plating quality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a rack gear and driving gear system is used to transfer the hanger, then the hanger can be moved along the rail, but vibration and noise occur due to gear engagement

Engineering Contradiction:

Improvetransfer speedVSAvoidvibration and noise

Core Design Contradiction:

SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a shock-absorbing structure with elastic elements (springs or elastomers) positioned between the rack gear and the hanger body. This cushioning element is pre-installed to absorb vibrations and shocks generated during gear engagement, preventing them from being transmitted to the hanger and its components. The elastic element deforms under vibration impact and returns to its original shape, continuously dampening harmful vibrations while maintaining transfer motion.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Productivity

If the hanger and rail are coupled and moved by a rack gear, then the printed circuit board can be transferred, but components of the hanger are released due to vibration

Engineering Contradiction:

Improvetransfer capabilityVSAvoidcomponent retention

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The shock-absorbing structure with elastic elements is pre-installed in the coupling between the rack gear and hanger to cushion vibrations before they can cause component release. The elastic element maintains constant contact pressure while absorbing vibration energy, ensuring components remain securely attached during transfer operations.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The elastic shock-absorbing element acts as an intermediary between the rigid rack gear and the hanger components. It mediates the force transmission by converting rigid mechanical coupling into a compliant connection that allows vibration isolation while maintaining functional coupling for motion transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If vibration is transferred to the jig coupled to the hanger, then the transfer process continues, but the printed circuit board may be separated from the jig or a non-uniform plating layer may be formed

Engineering Contradiction:

Improvetransfer continuityVSAvoidplating uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The shock-absorbing structure with elastic elements is positioned to cushion vibrations before they reach the jig and printed circuit board. This prevents separation between the board and jig while maintaining continuous transfer motion. The elastic element absorbs vibration energy that would otherwise cause positioning errors or plating defects.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The elastic shock-absorbing element serves as an intermediary that isolates the precision assembly (jig and printed circuit board) from vibration sources. It allows the transfer function to continue while filtering out harmful vibrations that would compromise plating precision and board attachment.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The shock-absorbing structure allows for uniform transfer of the printed circuit board, reducing noise and shock, thereby enhancing adhesion and preventing non-uniform plating and component failures, ensuring a stable and consistent plating process.

Implementation Method 1

an elastic spring is pressed by the load of the plating hanger device and a jig

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

reducing the noise and shock generated during transferring by means of the elastic spring

Methodology Applied

Scientific EffectShock absorption: Damping

Data Source

PatentUS11219131B2Plating hanger device having shock-absorbing structure

Publication Date: 2022.01.04 NEOPMC

AI summary

The present invention relates to a plating hanger device having a shock-absorbing structure and, more specifically, to a plating hanger device having a shock-absorbing structure, the device allowing a hanger to be transferred at a uniform speed and reducing noise and shock, which are generated during transferring, so as to enable a uniform plated layer to be formed on a substrate. According to the plating hanger device having the shock-absorbing structure, of the present invention, an elastic spring is pressed by the load of the plating hanger device and a jig, and sequentially, the elastic spring presses a connection shaft and the connection shaft presses a transfer housing so as to improve adhesion between the transfer housing and a driving gear, thereby enabling transferring at uniform speed, and reducing the noise and shock generated during transferring by means of the elastic spring.