Plating Apparatus Heating Gas Substrate Temperature Control
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Solution Overview
Problem
During the plating process, the mixing of plating liquid and rear-surface temperature-controlling water in waste liquid makes it difficult to separate and reuse the plating liquid, which is expensive and valuable.
Innovation Solution
A plating apparatus that uses a heating gas with higher specific heat capacity than air, such as steam, to efficiently heat the substrate while preventing the mixing of temperature-controlling water with the plating liquid, allowing for effective separation and reuse of the plating liquid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If rear-surface temperature-controlling water is supplied to the substrate, then the substrate temperature can be controlled, but the plating liquid and temperature-controlling water mix in the waste liquid making it difficult to separate and reuse the plating liquid
Solution Approach 1:
The invention segments the temperature control function into two separate systems: front surface temperature control using heated plating liquid, and rear surface temperature control using a heated gas flow path. This segmentation prevents mixing of plating liquid and temperature-controlling water while maintaining effective temperature control of the substrate
Solution Approach 2:
The invention introduces a heating gas (such as nitrogen or air) as an intermediary medium for rear surface temperature control. This gas flows through a dedicated flow path that does not contact the plating liquid, thereby mediating the heat transfer from the rear surface without causing contamination or mixing issues
2Temperature
If plating liquid heated to high temperature is supplied to the substrate, then the substrate temperature can be controlled, but the plating liquid becomes difficult to reuse due to mixing with temperature-controlling water
Solution Approach 1:
The invention divides the temperature control into separate front and rear surface systems, with the rear surface using a gas flow path that is completely separate from the plating liquid circulation system. This eliminates the need for complex separation equipment while maintaining temperature control effectiveness
Solution Approach 2:
The invention replaces the mechanical liquid-based rear surface temperature control system with a gas-based system. This substitution eliminates the mixing problem between plating liquid and temperature-controlling water, simplifying the overall system and reducing the need for complex separation mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently heats the substrate and prevents the mixing of plating liquid with temperature-controlling water, enabling easy reuse of the plating liquid and reducing waste.
Implementation Method 1
a gas supplying device configured to heat a heating gas having a higher specific heat capacity than air and supply the heated heating gas toward the substrate
Implementation Method 2
supply the heated heating gas toward the substrate held by the substrate holding device
Data Source
AI summary
A plating apparatus 20 includes a substrate holding device 110 configured to hold a substrate W; a discharging device 21 configured to discharge a plating liquid 35 toward the substrate W held by the substrate holding device 110; and a plating liquid supplying device 30 connected to the discharging device 21 and configured to supply the plating liquid 35 to the discharging device 21. A gas supplying device 170 is configured to heat a heating gas G having a higher specific heat capacity than air and supply the heated heating gas G toward the substrate W held by the substrate holding device 110. Further, a controller 160 is configured to control at least the discharging device 21, the plating liquid supplying device 30, and the gas supplying device 170.