Plating Apparatus Holder Cover Grooves Agitation
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Solution Overview
Problem
Conventional cup type plating apparatuses with paddles for solution agitation face issues of non-uniform plating film formation due to reduced paddle speed near ends and potential electric field shadows, leading to decreased film uniformity and increased apparatus size.
Innovation Solution
A plating apparatus with a rotating substrate holder and holder cover having cover grooves to agitate the solution, along with a turbulence generating member with an Archimedean spiral internal flow passage to enhance solution circulation and reduce electric field hindrance, eliminating the need for a paddle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a paddle is arranged in the plating tank to agitate the plating solution, then the plating solution can be agitated, but the moving speed of the paddle decreases near both ends in reciprocating direction and thus the uniformity of plating film decreases
Solution Approach 1:
The invention removes the paddle from the plating tank and replaces it with a holder cover that rotates with the substrate holder. This extraction of the problematic paddle eliminates the speed variation issue while maintaining solution agitation through the rotational motion of the holder cover.
Solution Approach 2:
The holder cover serves multiple functions: it protects the substrate holder, and simultaneously agitates the plating solution through its rotation. This multi-functionality eliminates the need for a separate paddle while achieving both protection and agitation purposes.
2Ease of operation
If a paddle is disposed in the plating tank to agitate the solution, then the plating solution can be agitated, but the plating apparatus increases in size
Solution Approach 1:
The invention merges the solution agitation function with the substrate holder assembly by making the holder cover rotate together with the substrate holder. This consolidation eliminates the need for a separate paddle and reduces the overall apparatus volume.
Solution Approach 2:
The holder cover performs both protection and agitation functions simultaneously, eliminating the need for additional components like paddles and thereby reducing the apparatus size.
3Ease of operation
If the paddle makes an instantaneous stop during reciprocating motion, then the paddle changes direction, but a shadow of electric field is formed on the substrate and thus the uniformity of plating film decreases
Solution Approach 1:
By removing the paddle and using the rotating holder cover instead, the invention eliminates the instantaneous stop problem that causes electric field shadows. The continuous rotation of the holder cover maintains consistent electric field distribution.
Solution Approach 2:
The invention transitions from the reciprocating motion of the paddle (which has instantaneous stops) to the continuous rotational motion of the holder cover. This dynamic change eliminates the electric field shadowing effect while maintaining solution agitation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform plating film formation without the drawbacks of paddle-based systems, maintaining film quality and reducing apparatus size.
Implementation Method 1
when the substrate holder rotates and causes the holder cover to rotate, the lower surface of the holder cover provided with the cover groove can agitate the plating solution
Implementation Method 2
the turbulence generating member being configured to generate turbulence in the plating solution flowing from below the substrate toward the substrate
Implementation Method 3
The internal flow passage in a bottom view of the turbulence generating member may have an Archimedean spiral shape
Implementation Method 4
a rotation mechanism configured to rotate the substrate holder
Implementation Method 5
a plating apparatus that can perform a plating process on a substrate
Data Source
AI summary
Provided is a plating apparatus and a plating solution agitating method that can agitate a plating solution without using a paddle.A plating apparatus 1000 includes a holder cover 50 disposed in a substrate holder 30 and configured to rotate with the substrate holder when the substrate holder rotates. The holder cover is configured to have a lower surface immersed in the plating solution with the lower surface positioned below a surface to be plated of a substrate. The lower surface of the holder cover is provided with at least one cover groove extending in a direction intersecting with a rotation direction of the holder cover.