Electrolytic Plating Holding Apparatus Edge Plating Control

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Solution Overview

Problem

Existing holding apparatuses for electrolytic plating treatments often result in uneven plating thickness, particularly at the edges of planar workpieces due to non-uniform electric field distribution, and may still deposit plating on edge parts despite shielding measures.

Innovation Solution

A holding apparatus with a front member featuring a plurality of electrodes and insulating parts that cover the edge of the planar workpiece, ensuring a controlled electric current flow and uniform electric field distribution, thereby reducing plating deposition on the edges by having an edge-part covering length of 80% or more, with insulating parts and electrodes alternately disposed along the edge and covered by an insulating film except at contact points.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a shielding plate is disposed between the planar workpiece and anode electrode to control electric current flow, then uniform electric field distribution is achieved, but plating is still deposited on the edge part of the workpiece

Engineering Contradiction:
Improveuniformity of plating film thicknessVSAvoidamount of plating deposited on edge part
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The front pressing plate is segmented into multiple functional regions: insulating parts (non-conductive resin) that cover edge portions to block current flow, and conducting parts (metal plates) that transmit current to the workpiece. This segmentation allows different portions of the same component to perform different functions - the insulating parts prevent edge plating while the conducting parts enable necessary current transmission for plating uniformity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the front pressing plate have different electrical properties tailored to local requirements. The insulating parts are positioned at edge regions where current blockage is needed, while conducting parts are positioned where current transmission is needed. This local differentiation of material properties (conductive vs. insulating) allows precise control over current distribution patterns to achieve uniform plating thickness while minimizing edge deposition.

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the front pressing plate is made from non-conductive resin with embedded conducting bars, then the shielding function is improved, but the edge part of the workpiece still gets plated

Engineering Contradiction:
Improvecontrol of electric field distributionVSAvoidplating deposition on edge part
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The front pressing plate is constructed as a composite structure combining non-conductive resin (for insulation and shielding) with embedded conducting bars or plates (for current transmission). This composite material approach allows the single component to simultaneously provide both insulating and conducting functions in different regions, enabling precise control of electric field distribution to prevent edge plating while maintaining overall plating uniformity.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively reduces the amount of plating deposited on the edge parts of the planar workpiece by controlling electric current flow and ensuring uniform electric field distribution, achieving a uniform plating thickness while minimizing edge deposition.

Implementation Method 1

An electric current is then provided between the planar workpiece and the anode electrode to perform the electrolytic plating treatment

Methodology Applied
Scientific EffectElectrolytic plating: Electroplating

Implementation Method 2

a thickness of a plating film is susceptible to electric field distribution between a planar workpiece and an anode electrode

Methodology Applied
Scientific EffectElectric field distribution: Electric Field

Data Source

PatentUS11891714B2Holding apparatus
Publication Date: 2024.02.06 C UYEMURA & CO LTD
  • US11891714B2 patent drawing
  • US11891714B2 patent drawing
  • US11891714B2 patent drawing

AI summary

A holding apparatus for applying an electrolytic plating treatment to a planar workpiece, and the holding apparatus can reduce an amount of plating that is deposited on an edge part of the planar workpiece. The holding apparatus for applying the electrolytic plating treatment to the planar workpiece has a rear member and a front member facing the rear member and having an opening part. The planar workpiece is disposed between the rear member and the front member. The front member has a plurality of electrodes and a plurality of first insulating parts. The plurality of electrodes and the plurality of first insulating parts cover the edge part of the planar workpiece in a width direction of the planar workpiece.