Plating Jig With Resilient And Polyhedral Members For Lead Wire Retention
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Solution Overview
Problem
Conventional plating methods for electronic components with lead wires, such as the barrel plating method and magnet-embedded electrode methods, face issues like lead wire entanglement, magnetic particle adhesion, and uneven plating due to length differences or non-conductive wires, leading to poor appearance and reduced yield.
Innovation Solution
A plating jig featuring a resilient member and polyhedral member accommodated in recessed holes on an electrode pad, with a cover body to prevent departure, allowing lead wires to be advanced and held without magnetic force, ensuring all wires are in contact and preventing magnetic particle adhesion, even with varying lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a magnet-embedded electrode is used to retain the lead wire, then the lead wire is retained without entanglement, but magnetic substance particles are adhered on the surface of the electronic component
Solution Approach 1:
The invention extracts and removes the magnet from the electrode structure. Instead of using a magnet-embedded electrode, the patent employs a simple conductive electrode without magnetic components, thereby eliminating the source of magnetic particle adhesion while maintaining the lead wire retention function through alternative means (mechanical clamping or positioning structures).
Solution Approach 2:
The invention introduces an intermediary mechanism (mechanical clamping structure or positioning feature) to retain the lead wire, replacing the direct magnetic retention method. This intermediary structure allows lead wire retention without magnetic field interaction, preventing magnetic particle adhesion on the component surface.
2Device complexity
If only one lead wire is contacted with the electrode, then the electrode structure is simple, but lead wires with length differences or non-conductive wires are not properly plated
Solution Approach 1:
The invention segments the lead wire contact function into multiple independent contact points or clamping positions on the electrode. This allows each lead wire to be individually retained and contacted, ensuring that all lead wires regardless of length or conductivity are properly positioned for uniform plating, while maintaining a relatively simple overall electrode structure.
Solution Approach 2:
The invention employs a dynamic or adjustable electrode structure that can adapt to different lead wire configurations. The electrode may include flexible or movable components that automatically adjust to contact and retain multiple lead wires with varying lengths, ensuring consistent electrical contact and uniform plating without requiring a complex fixed structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents magnetic particle adhesion, ensures uniform plating across multiple lead wires, and maintains electrical conductivity, improving the appearance and yield of plated components.
Implementation Method 1
a resilient member and a polyhedral member which are accommodated in a mutually adjacent manner into a recessed hole formed at least in one on the surface of an electrode pad
Implementation Method 2
plating method for an electronic component by using the jig... plating the electronic component
Data Source
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AI summary
The resilient member 30 and the polyhedral member 40 are accommodated in a mutually adjacent manner in the recessed hole 22 formed at least in one on the surface of the electrode pad 20, the cover body 50 for preventing the resilient member 30 and the polyhedral member 40 from departing from the recessed hole 22 is disposed in such an arrangement as to cover the surface of the electrode pad 20, the opening port 52 for advancement of the lead wire 64 is formed at a position corresponding to the recessed hole 22 on the cover body 50, and the lead wire 64 of an electronic component is allowed to advance between the inner wall face of the recessed hole and the wall face of the polyhedral member 40 from the opening port 52 against the resilient force of the resilient member 30 and the lead wire 64 is held between the wall face of the polyhedral member 40 and the inner wall face of the recessed hole 22, thereby retaining the electronic component.