Plating Liquid Temperature Control via Fluid Pushing
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Solution Overview
Problem
In plating processing on substrates, maintaining a high temperature state for the plating liquid in temperature controllers for extended periods can lead to the precipitation of plating components, degrading the quality of the plating liquid and the processing.
Innovation Solution
A substrate liquid processing apparatus that includes a temperature controller connected via a flow path to a plating liquid sending device, where a fluid different from the plating liquid is used to push the temperature-controlled plating liquid from the temperature controller to a nozzle, thereby reducing the time the plating liquid is kept in a high temperature state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If the plating liquid is kept in a high temperature state in the heat exchanger for a long time, then the plating liquid can be continuously supplied to the substrate, but the plating components precipitate and the quality of the plating liquid degrades
Solution Approach 1:
The patent extracts the plating liquid from the heat exchanger using a plating liquid sending device (pump) and transports it to the substrate through a flow path. This separation allows the heat exchanger to maintain a small volume of plating liquid at high temperature, while the majority of plating liquid is continuously replenished from the storage tank, preventing precipitation in the supply system.
Solution Approach 2:
The patent performs preliminary heating of the plating liquid in the heat exchanger before supply. The plating liquid is heated to the required temperature in advance, then continuously sent to the substrate. This ensures that the plating liquid reaches the substrate at the appropriate temperature without requiring the entire supply system to be maintained at high temperature, thus preventing precipitation.
2Reliability
If the heat exchanger volume is reduced to minimize plating liquid heating time, then precipitation is suppressed, but the system may not provide enough heated liquid for continuous processing
Solution Approach 1:
The patent divides the plating liquid supply system into two functional segments: a small heat exchanger for temperature control and a large storage tank for liquid reservoir. The heat exchanger (with minimal plating liquid volume) heats the liquid to required temperature, while the storage tank provides continuous replenishment. This segmentation allows both short heating time (preventing precipitation) and continuous supply capability to coexist.
Solution Approach 2:
The patent introduces a plating liquid sending device (pump) as an intermediary between the heat exchanger and the substrate supply path. This pump continuously transports the heated plating liquid from the heat exchanger to the substrate, enabling continuous processing. The intermediary device decouples the heating capacity from the supply rate, allowing a small heat exchanger to support continuous high-volume supply.
3Quantity of substance
If a large volume of plating liquid is kept in the heat exchanger, then continuous supply is ensured, but the time for precipitation increases
Solution Approach 1:
The patent extracts only the necessary amount of plating liquid from the storage tank into the heat exchanger at any given time. The heat exchanger maintains a minimal volume of plating liquid (just enough to ensure continuous supply), while the bulk of the plating liquid remains in the storage tank at ambient temperature. This extraction approach minimizes the volume of heated liquid, thereby reducing precipitation risk while maintaining supply continuity.
Solution Approach 2:
The patent performs preliminary heating of only the required amount of plating liquid in the heat exchanger before it is needed for substrate processing. The plating liquid is heated in advance to the exact temperature required, then immediately supplied to the substrate. This preliminary action ensures that the heated liquid volume is minimized at any moment, preventing precipitation while ensuring continuous supply readiness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses the precipitation of plating components, improves the quality of the plating liquid, and reduces the need for frequent cleaning and maintenance of the temperature controller.
Implementation Method 1
a temperature controller connected to the plating liquid sending device via a first flow path and configured to control a temperature of a fluid supplied through the first flow path
Implementation Method 2
a fluid sending device configured to send a fluid different from the plating liquid to the first flow path
Data Source
AI summary
A substrate liquid processing apparatus configured to supply a plating liquid to a substrate includes a substrate holder configured to hold the substrate; a plating liquid sending device configured to send the plating liquid to a first flow path; a temperature controller connected to the plating liquid sending device via the first flow path and configured to control a temperature of a fluid supplied through the first flow path; a fluid sending device configured to send a fluid different from the plating liquid to the first flow path; and a discharge device connected to the temperature controller and configured to discharge a fluid supplied from the temperature controller.