Plating Liquid Temperature Control for Film Uniformity
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Solution Overview
Problem
Conventional liquid treatment apparatuses face challenges in maintaining the quality of plating liquids during continuous processing, particularly when the process is stopped, leading to deterioration and uneven cap metal film thickness on substrates due to temperature-related particle generation.
Innovation Solution
A liquid treatment apparatus with a temperature controlling container, controller, holding unit, nozzle, pushing unit, and supply control unit that maintains and controls the temperature of the plating liquid, ensuring uniform distribution and preventing quality deterioration by managing the timing of plating liquid supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the plating liquid is heated to processing temperature and the process is stopped, then the process can be paused, but the quality of the plating liquid deteriorates due to particle generation
Solution Approach 1:
The system performs preliminary actions by detecting process stop conditions and immediately initiating cooling of the plating liquid before significant particle generation occurs. The detection unit identifies stop conditions, and the cooling unit is activated in advance to prevent quality deterioration, rather than waiting for particles to form.
Solution Approach 2:
The system implements feedback control through the detection unit that monitors process status and provides information to the control unit. When a stop condition is detected, the feedback triggers the cooling unit to activate, creating a closed-loop control system that responds to actual process conditions rather than operating open-loop.
2Productivity
If the plating liquid is continuously heated to maintain processing temperature, then the plating process can resume quickly, but particles are generated from the heated plating liquid
Solution Approach 1:
The system uses periodic action by alternately heating and cooling the plating liquid based on process requirements. During active plating, the liquid is heated to processing temperature. When the process stops, the cooling unit activates to cool the liquid periodically, preventing continuous heating that would generate particles, while still allowing quick resumption when needed.
Solution Approach 2:
The system changes the temperature parameter of the plating liquid dynamically based on process state. The temperature is raised to processing temperature during plating operations and reduced when the process stops. This parameter change prevents particle generation by avoiding prolonged exposure to high temperatures while maintaining productivity through rapid temperature adjustment.
3Adaptability or versatility
If the process is stopped, then process flexibility is improved, but uniform cap metal film thickness cannot be maintained on the substrate
Solution Approach 1:
The system takes preliminary action by cooling the plating liquid before particle generation significantly impacts film quality. When the process stops, the cooling unit is activated in advance to prevent particle formation that would otherwise occur during extended pauses, thereby maintaining the ability to produce uniform films even after process interruptions.
Solution Approach 2:
The system changes the temperature parameter to prevent particle generation during process stops. By reducing the plating liquid temperature when the process is paused, the chemical reactions that generate particles are suppressed, allowing the process to be stopped and restarted while maintaining manufacturing precision of the cap metal film thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively prevents plating liquid quality deterioration, ensuring uniform cap metal film thickness and maintaining process efficiency even when the process is paused or stopped, by continuously controlling and reheating the plating liquid.
Implementation Method 1
a temperature controller configured to control a temperature of the plating liquid accommodated in the temperature controlling container
Implementation Method 2
a pushing unit configured to push the temperature-controlled plating liquid accommodated in the temperature controlling container toward the supply hole of the nozzle
Implementation Method 3
a nozzle having a supply hole through which the temperature-controlled plating liquid accommodated in the temperature controlling container is discharged to a processing surface of the substrate held by the holding unit
Data Source
AI summary
A liquid treatment apparatus of continuously performing a plating process on multiple substrates includes a temperature controlling container for accommodating a plating liquid; a temperature controller for controlling a temperature of the plating liquid in the temperature controlling container; a holding unit for holding the substrates one by one at a preset position; a nozzle having a supply hole through which the temperature-controlled plating liquid in the temperature controlling container is discharged to a processing surface of the substrate; a pushing unit for pushing the temperature-controlled plating liquid in the temperature controlling container toward the supply hole of the nozzle; and a supply control unit for controlling a timing when the plating liquid is pushed by the pushing unit. The temperature controller controls the temperature of the plating liquid in the temperature controlling container based on the timing when the plating liquid is pushed by the pushing unit.