Plating Cell Mask With Auxiliary Anode for Uniform Film Thickness
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Solution Overview
Problem
Existing plating technologies face challenges in achieving uniform film thickness distribution across substrates with varying specifications, particularly due to terminal effects, which require complex mechanical mechanisms and are difficult to implement in plating apparatuses for larger rectangular substrates, and are not suitable for vertically standing substrates.
Innovation Solution
An apparatus with an anode and an intermediate mask featuring a first center opening and an auxiliary anode within the mask, where the auxiliary anode's area is less than 1/5 of the anode's area, allowing for electric field regulation without mechanical mechanisms, thereby adjusting plating current based on substrate specifications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the auxiliary electrode is placed on the anode side further from the substrate, then the electric field can be regulated, but the plating current control effectiveness decreases and large area is required
Solution Approach 1:
The patent inverts the conventional placement of the auxiliary electrode by positioning it on the cathode side near the substrate instead of on the anode side. This inversion allows the auxiliary electrode to effectively regulate plating current at the substrate surface with a smaller area, as it is now closer to the region where current control is most critical for achieving uniform film thickness.
Solution Approach 2:
The patent changes the spatial dimension of auxiliary electrode placement from the anode side (away from substrate) to the cathode side (near substrate). This dimensional change in position allows for more effective current control with reduced electrode area, as the auxiliary electrode can directly influence the electric field distribution at the substrate interface.
2Adaptability or versatility
If mechanically change the openings of the intermediate mask and anode mask, then the plating current can be adjusted, but the device complexity increases and dimensional accuracy requirements are high
Solution Approach 1:
The patent replaces the mechanical system of adjustable mask openings with an electrical control system using an auxiliary electrode. Instead of mechanically changing the geometry of the intermediate mask and anode mask to adjust plating current, the system uses electrical current control through the auxiliary electrode, thereby reducing mechanical complexity and eliminating the need for high-precision mechanical adjustments.
Solution Approach 2:
The patent changes the control parameter from geometric (mask opening dimensions) to electrical (auxiliary electrode current). By controlling the current flowing through the auxiliary electrode, the system can adjust plating current without changing the physical dimensions of the mask openings, thus avoiding mechanical complexity while maintaining adaptability.
3Manufacturing precision
If individually setting respective plating cells according to substrate specifications, then the surface leveling can be achieved, but the throughput decreases
Solution Approach 1:
The patent creates a universal plating cell configuration that can handle multiple substrate specifications simultaneously. The auxiliary electrode system allows a single plating cell to be adjusted for different substrate types by controlling electrical parameters, eliminating the need to individually set up separate plating cells for each substrate specification and thereby maintaining high throughput.
Solution Approach 2:
The patent introduces dynamic control capability to the plating cell through the auxiliary electrode system. Instead of static, fixed configurations for different substrate types, the system can dynamically adjust the auxiliary electrode current and position to optimize plating conditions for various substrate specifications in real-time, allowing one cell to serve multiple purposes without sacrificing surface leveling quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively controls plating current to achieve uniform film thickness distribution across substrates, reducing the need for mechanical adjustments and maintaining plating solution integrity, suitable for both rectangular and vertically standing substrates.
Implementation Method 1
an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening
Implementation Method 2
apparatus for plating a substrate... controls plating current to achieve uniform film thickness distribution
Data Source
AI summary
There is provided an apparatus for plating a substrate, comprising: an anode placed to be opposed to the substrate; and an intermediate mask placed between the substrate and the anode to be arranged on a substrate side, provided with a first center opening that causes an electric field from the anode toward the substrate to pass through, and further provided with an auxiliary anode that is placed in an internal space of the intermediate mask to be arranged around the first center opening, wherein the auxiliary anode has an area that is not greater than ⅕ of an area of the anode.