Plating Apparatus Mesh Injector for Target Integrity

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Solution Overview

Problem

Existing jet flow-type plating apparatuses face challenges in preventing excessive upward movement of plating targets in the plating solution, which can lead to defects such as cracking, chipping, or peeling of plated films, especially when the flow rate of the plating solution is increased.

Innovation Solution

The plating apparatus incorporates a mesh portion at the injection port of the injector, with a central portion having a double mesh structure and a circumferential portion having a single mesh structure, to control the speed of the plating solution and prevent excessive upward movement of plating targets.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the flow rate of the plating solution is increased to improve productivity, then the plating efficiency is improved, but the plating targets are excessively moved upward in the plating solution causing defects such as cracking, chipping, or peeling of plated films

Engineering Contradiction:
Improveplating efficiencyVSAvoidplating target integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The mesh portion is divided into a central portion with a first mesh and a circumferential portion with a second mesh. This segmentation allows different regions to provide different levels of resistance to the plating solution flow, controlling the upward movement of plating targets while maintaining high flow rates for productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The central portion and circumferential portion of the mesh portion are configured with different mesh structures (first mesh vs. second mesh). This local quality differentiation enables precise control of fluid dynamics in different regions, preventing excessive upward movement of plating targets in the central region while allowing adequate flow for efficient plating.

Inventive Principle:
Principle #3Local quality

2Reliability

If a mesh portion with uniform mesh structure is used to prevent excessive upward movement of plating targets, then plating target integrity is maintained, but the control precision over plating solution flow distribution is insufficient

Engineering Contradiction:
Improveplating target integrityVSAvoidfilm thickness uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The mesh portion is segmented into central and circumferential portions with different mesh structures. This segmentation enables precise control of plating solution flow distribution, ensuring uniform film thickness while preventing target defects through differentiated flow resistance in different regions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different mesh structures are applied to different regions (central vs. circumferential portions) to achieve local optimization. The first mesh in the central portion and second mesh in the circumferential portion provide tailored flow control, simultaneously ensuring film uniformity and target integrity.

Inventive Principle:
Principle #3Local quality

3Device complexity

If a single mesh layer is used at the injection port to simplify the structure, then device complexity is reduced, but the ability to control plating solution momentum and prevent target defects is insufficient

Engineering Contradiction:
Improvemesh structure complexityVSAvoidplating target integrity
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The mesh portion is segmented into two functional regions with different mesh structures, providing enhanced control capability over plating solution flow and momentum. This segmentation effectively prevents target defects while maintaining reasonable structural complexity through a systematic dual-mesh design.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces or prevents defects in the plating targets by controlling the momentum of the plating solution, allowing for increased flow rates without causing excessive upward movement of the targets, thereby maintaining film thickness uniformity.

Implementation Method 1

The mesh portion is made by stacking at least two meshes. The mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. The circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. The central portion is made of a plurality of layers of the mesh.

Methodology Applied
Scientific EffectFluid resistance: Drag

Data Source

PatentUS20250116024A1Plating apparatus
Publication Date: 2025.04.10 MURATA MFG CO LTD
  • US20250116024A1 patent drawing
  • US20250116024A1 patent drawing
  • US20250116024A1 patent drawing

AI summary

A plating apparatus includes a plating bath storing a plating solution and plating targets, and an injector in the plating bath. The injector includes a first injection port to inject the plating solution. The plating targets included in the plating solution are stirred by the plating solution injected from the injector. A mesh portion is provided at the first injection port. The mesh portion is defined by at least two stacked meshes. The mesh portion includes a central portion and a circumferential portion provided outside the central portion when viewed in a planar direction. The circumferential portion is defined by one layer of the mesh or a plurality of layers of the mesh. The central portion is defined by a plurality of layers of the mesh. A number of layers of the mesh in the central portion is greater than that of the circumferential portion.