Plating Apparatus Micro-Throwing Power Measurement
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Solution Overview
Problem
Conventional Haring cell tests are unable to measure micro-throwing power, which is the ability to deposit a film uniformly in recesses or complex shapes, as they primarily assess macro-throwing power across the entire surface.
Innovation Solution
A plating apparatus with an anode in a plating bathtub, an insulating substrate with holes, and a pair of cathodes positioned at the bottom and surface of the holes, along with a plating power source and measurement circuits to assess electric currents and voltages, allowing for the evaluation of micro-throwing power by ensuring constant electric current flow and feedback control to equalize electrode potentials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional Haring cell test is used, then macro-throwing power measurement is achieved, but micro-throwing power measurement capability is lost
Solution Approach 1:
The invention divides the measurement function into two independent measurement systems: one for macro-throwing power (overall surface deposition) and one for micro-throwing power (recess area deposition). This segmentation allows both measurement capabilities to coexist without interfering with each other, resolving the contradiction between maintaining macro measurement precision and adding micro measurement versatility.
Solution Approach 2:
The invention creates a multi-functional measurement system that can perform both macro-throwing power measurement and micro-throwing power measurement using the same plating apparatus. By integrating multiple measurement functions into a single system, the apparatus achieves versatility in measurement capability scope while maintaining the established macro measurement precision.
2Adaptability or versatility
If insulating substrate with holes and pair of cathodes is introduced, then micro-throwing power measurement becomes possible, but device complexity increases
Solution Approach 1:
The invention places the pair of cathodes inside the holes of the insulating substrate, creating a nested structure where the cathodes are positioned within the recesses. This nesting approach allows the measurement structure to be compact and integrated, reducing the overall device complexity while enabling micro-throwing power measurement capability.
Solution Approach 2:
The insulating substrate acts as an intermediary component that holds the pair of cathodes in precise positions within the holes. This intermediary structure simplifies the overall design by providing a ready-made mounting solution for the cathodes, reducing the complexity of positioning and securing them directly in the plating bath.
3Measurement precision
If electric current measuring portion and voltage measuring portion are added, then measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The invention combines the electric current measuring portion and voltage measuring portion into an integrated measurement system that simultaneously monitors both parameters. By merging these measurement functions, the system achieves improved measurement accuracy through coordinated data collection while reducing the overall complexity compared to having separate independent measurement systems.
Solution Approach 2:
The measuring portions provide real-time feedback on electric current and voltage values, enabling precise control and monitoring of the plating process. This feedback mechanism improves measurement accuracy by allowing continuous adjustment and verification, while the automated nature of the feedback system reduces the need for complex manual measurement procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the accurate measurement of micro-throwing power, ensuring uniform film deposition in complex shapes by maintaining constant electric current and equalizing electrode potentials, thus improving the assessment of plating performance in recessed areas.
Implementation Method 1
plating is performed with an anode disposed between a pair of cathodes
Implementation Method 2
an electric current measuring portion configured to measure respective values of electric currents flowing through the pair of cathodes
Data Source
AI summary
There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).