Plating Module Porosity and Head-Plate Distance Adjustment
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Solution Overview
Problem
Existing methods for adjusting plating modules in cup-type electroplating apparatuses face challenges in achieving uniform film thickness distribution due to axis misalignment, differences in parallelism, and dimensional tolerances, leading to variability among individual plating modules.
Innovation Solution
A method involving an initial setting of the plating module where the porosity in the outer circumferential portion of the plate is adjusted to reduce film thickness, followed by adjusting the distance between the substrate holder and the plate to flatten the film thickness distribution across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional alignment methods are used to assemble the plating module, then the assembly process is simple, but axis misalignment and parallelism differences occur leading to non-uniform film thickness distribution
Solution Approach 1:
The patent applies preliminary action by pre-adjusting the distance between the substrate holder and plate during module assembly to compensate for expected alignment errors. This preliminary adjustment, combined with initial porosity settings, creates a baseline configuration that anticipates and counteracts the non-uniform film thickness that would otherwise result from simple conventional alignment methods.
Solution Approach 2:
The patent employs parameter changes by systematically adjusting multiple parameters including the distance between substrate holder and plate, the porosity distribution in the plate, and the alignment position of components. These parameter adjustments are made in a coordinated manner to achieve uniform film thickness, transforming the fixed parameters of conventional assembly into variable parameters that can be optimized for each specific module.
2Manufacturing precision
If individual plating modules are assembled with standard tolerances, then manufacturing cost is reduced, but film thickness uniformity deteriorates due to variability among modules
Solution Approach 1:
The patent applies local quality by creating non-uniform porosity distribution within the plate structure. The plate is designed with different porosity levels in different regions (higher porosity in outer circumferential portions, lower porosity in central portions), allowing each region to compensate for local alignment errors and produce uniform film thickness across the entire substrate despite using components manufactured with standard tolerances.
Solution Approach 2:
The patent implements feedback mechanisms by measuring the actual film thickness distribution on test substrates and using this information to adjust the distance between substrate holder and plate for subsequent production. This closed-loop feedback process allows modules assembled with standard tolerances to be calibrated to achieve the required film thickness uniformity, reconciling manufacturing ease with manufacturing precision.
3Manufacturing precision
If the porosity in the outer circumferential portion of the plate is adjusted to reduce film thickness there, then film thickness uniformity is improved, but the overall film thickness distribution requires additional adjustment
Solution Approach 1:
The patent applies preliminary action by pre-configuring the plate with optimized porosity distribution during manufacturing, and pre-adjusting the substrate holder-to-plate distance during module assembly. This preliminary setup performs the bulk of the uniformity correction work before production begins, reducing the need for time-consuming adjustments during operation and thereby improving productivity while maintaining film thickness uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses or prevents the reduction of uniformity in plating film thickness, achieving improved in-plane uniformity by adjusting the head-plate distance based on the actual film thickness distribution.
Implementation Method 1
a plate placed between the substrate holder and the anode to serve as an ionically resistive element
Implementation Method 2
a voltage is applied between the substrate and an anode, so that a conductive film (plating film) deposits on the surface of the substrate
Implementation Method 3
a voltage is applied between the substrate and an anode, so that a conductive film (plating film) deposits on the surface of the substrate
Data Source
AI summary
There is provided a method of adjusting a plating module, wherein the plating module comprises a substrate holder configured to hold a substrate, an anode placed to be opposed to the substrate holder, and a plate placed between the substrate holder and the anode to serve as an ionically resistive element. The method comprises: providing a plating module of initial setting, which is initially set in such a state that a porosity in an outer circumferential portion of the plate is adjusted to reduce a plating film thickness in an outer circumferential portion of the substrate to be smaller than a film thickness in another portion; and adjusting a distance between the substrate holder and the plate so as to flatten a distribution of plating film thickness of the entire substrate by adjustment of the distance between the substrate holder and the plate such as to increase a film thickness in the outer circumferential portion of the substrate according to a film thickness distribution of the substrate that is plated in the plating module.