Plating Apparatus Paddle Velocity for Uniform Film
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Solution Overview
Problem
Conventional plating apparatuses under high-current density conditions often result in bumps with convex tops, leading to increased costs due to excess resin application and polishing, and poor in-plane uniformity of plated films, which is critical for high-density packaging and performance.
Innovation Solution
A plating apparatus with a paddle that reciprocates at an average velocity of 70 cm/sec to 100 cm/sec between the anode and substrate, combined with a regulation plate to control electric potential distribution, and a separation plate to manage electric fields, ensuring uniform ion supply and film thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-current density conditions are used to shorten plating time, then productivity is improved, but manufacturing precision deteriorates due to convex-top bumps and poor in-plane uniformity
Solution Approach 1:
The paddle is made movable to dynamically stir the plating solution during the plating process. This dynamic stirring action ensures uniform distribution of metal ions throughout the solution, preventing localized depletion and enabling high-current density plating while maintaining excellent in-plane uniformity of the plated film thickness.
Solution Approach 2:
The invention optimizes the paddle movement velocity parameter to a specific range (5-20 cm/sec) to achieve the desired balance between ion supply and plating rate. By controlling this parameter, the system can operate at high current density while maintaining manufacturing precision.
2Productivity
If conventional plating apparatuses are used under high-current density conditions, then productivity is improved, but manufacturing precision deteriorates due to convex-top bumps requiring excess resin and polishing
Solution Approach 1:
The movable paddle creates dynamic ion distribution that prevents the formation of convex-top bumps. The continuous stirring action ensures uniform ion supply to all areas of the substrate, resulting in flat-top bumps that eliminate the need for excess resin application and polishing, thereby maintaining manufacturing precision while achieving high productivity.
3Manufacturing precision
If the distance between regulation plate and plating object is minimized, then manufacturing precision is improved for uniform electric potential distribution, but device complexity increases
Solution Approach 1:
The regulation plate is designed with multiple functions: it regulates electric potential distribution, supports the paddle mechanism, and provides structural stability. By integrating these functions into a single component, the invention achieves uniform electric potential distribution without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the formation of bumps with flat tops and enhances the in-plane uniformity of plated films, reducing costs and improving the quality of plated films under high-current density conditions.
Implementation Method 1
a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution
Implementation Method 2
a predetermined plating voltage is applied between the anode and the substrate, thereby depositing a metal and forming a metal film (plated film) on the surface of the substrate
Implementation Method 3
the distribution of electric potential in a plating solution can be made uniform. It is therefore expected that electroplating will be capable of obtaining a metal film excellent in the in-plane thickness uniformity
Data Source
AI summary
A plating apparatus can form a bump having a flat top or can form a metal film having a good in-plane uniformity even when the plating of a plating object (substrate) is carried out under high-current density conditions. The plating apparatus includes a plating tank for holding a plating solution; an anode to be immersed in the plating solution in the plating tank; a holder for holding a plating object and disposing the plating object at a position opposite the anode; a paddle, disposed between the anode and the plating object held by the holder, which reciprocates parallel to the plating object to stir the plating solution; and a control section for controlling a paddle drive section which drives the paddle. The control section controls the paddle drive section so that the paddle moves at a velocity whose average absolute value is 70 cm/sec to 100 cm/sec.