Plating-pattern plate with electrically independent transfer parts

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Solution Overview

Problem

Existing methods for forming conductive patterns on substrates using electrolytic plating often result in inconsistent quality and difficulty in detecting defects such as disconnections or short circuits, particularly due to the electrical connection of transfer parts during the manufacturing process.

Innovation Solution

A plating-pattern plate is designed with transfer parts that are electrically independent and made of an alloy of iron and nickel, featuring a light-transmissive base body and a resin part to enhance peelability and accuracy, allowing for the formation of fine conductive patterns with stable quality through electroless plating and a removability-enhancing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If transfer parts are electrically connected on the plating-pattern plate, then plating can be performed continuously, but defect detection becomes difficult and quality consistency deteriorates

Engineering Contradiction:
Improvecontinuous plating capabilityVSAvoidquality consistency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The plating-pattern plate is divided into multiple electrically independent transfer parts, each capable of being controlled separately. This segmentation allows individual parts to be monitored and adjusted independently, improving both defect detection capability and quality consistency while maintaining continuous plating capability across multiple parts.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If transfer parts are electrically connected, then manufacturing process is simplified, but defect detection and measurement become difficult

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoiddefect detection capability
Core Design Contradiction:
Ease of manufactureVSDifficulty of detecting and measuring

Solution Approach 1:

By segmenting the transfer parts into electrically independent units with separate electrode connections, the plate maintains manufacturing simplicity while enabling individual defect detection. Each segment can be tested independently for disconnections or short circuits without affecting other segments.

Inventive Principle:
Principle #1Segmentation

3Device complexity

If conventional plating methods are used, then process is simple, but fine conductive patterns cannot be formed with stable quality

Engineering Contradiction:
Improveplating process complexityVSAvoidfine pattern quality
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The segmented transfer parts with electrically independent electrodes enable precise control of plating parameters for each region, allowing fine conductive patterns to be formed with stable quality while keeping the overall process relatively simple.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

By changing the electrical independence parameter of transfer parts, the plating process can achieve fine pattern precision through independent parameter control of each transfer part, enabling stable quality formation of fine conductive patterns.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables the formation of fine conductive patterns with stable quality and easy defect detection, as transfer parts are electrically independent, and the use of a light-transmissive base body and fluorine-containing resin enhances peelability and accuracy, ensuring uniform transfer and high-quality conductive patterns.

Implementation Method 1

a method of forming a conductive pattern on a substrate by electrolytic plating is known

Methodology Applied
Scientific EffectElectroplating: Electroplating

Implementation Method 2

a resin part that blocks light to prevent photoreactive resin curing

Methodology Applied
Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS11479860B2Pattern plate for plating and method for manufacturing wiring board
Publication Date: 2022.10.25 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US11479860B2 patent drawing
  • US11479860B2 patent drawing
  • US11479860B2 patent drawing

AI summary

A plating-pattern plate is configured to transfer, to a substrate, a transfer pattern formed by plating. The plating-pattern plate includes a base body and transfer parts disposed on the base body. Each of the transfer parts has a transfer surface configured to have the transfer pattern to be formed on the transfer surface by plating. The transfer parts are disposed electrically independent of one another on the base body. The plating-pattern plate provides a fine conductive pattern with stable quality.