Plating Pattern Formation With Superhydrophobic Film for Crack-Free Adhesion
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Solution Overview
Problem
Existing methods for forming plating patterns in semiconductor devices face challenges such as increased risk of cracks in photosensitive material layers and prolonged peeling times due to high-temperature heat treatments, as well as issues like leaching and weakened adhesion in plating solutions.
Innovation Solution
A method involving the formation of a superhydrophobic film with protrusions on a photosensitive material layer, allowing for the creation of a plating pattern by immersing the layer in a plating solution without the need for high-temperature heat treatments, thereby reducing damage to the photosensitive material and improving adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-temperature heat treatment is applied to form plating patterns, then adhesion strength is improved, but cracks occur in the photosensitive material layer
Solution Approach 1:
The patent changes the temperature parameter from high-temperature heat treatment to room temperature or low-temperature plating conditions. The plating solution is applied at temperatures that do not cause thermal stress or cracking in the photosensitive material layer, while still achieving adequate adhesion through chemical bonding mechanisms rather than thermal bonding.
Solution Approach 2:
The patent replaces the thermal field (heat treatment) with a chemical field (plating solution chemistry). Instead of using high-temperature thermal energy to improve adhesion, the invention uses chemical reactions between the plating solution and the substrate at lower temperatures to achieve strong adhesion without causing cracks.
2Strength
If high-temperature heat treatment is used to form plating patterns, then adhesion is improved, but peeling time is prolonged
Solution Approach 1:
The patent changes the temperature parameter from high to low, and modifies the chemical composition of the plating solution to enable controlled adhesion. The plating solution contains chemicals that form bonds with controlled strength - strong enough to provide adequate adhesion during processing, but weak enough to allow easy peeling when needed, thus reducing peeling time without requiring high-temperature treatment.
Solution Approach 2:
The patent creates different local properties in the plating layer. The plating solution forms regions with varying adhesion characteristics - stronger adhesion in areas where pattern stability is needed, and weaker adhesion in areas where easy peeling is desired. This local differentiation allows simultaneous achievement of adequate adhesion and reduced peeling time.
3Manufacturing precision
If photosensitive material layer is exposed to plating solution, then plating pattern is formed, but leaching and weakened adhesion occur
Solution Approach 1:
The patent introduces a barrier layer or protective coating as an intermediary between the photosensitive material layer and the plating solution. This intermediary layer allows the plating solution to access the substrate for pattern formation while preventing direct harmful interaction with the photosensitive material, thus avoiding leaching and adhesion weakening.
Solution Approach 2:
The patent modifies the chemical parameters of the plating solution, such as pH, concentration, and composition, to reduce its aggressiveness toward the photosensitive material. By adjusting these parameters, the solution maintains its ability to form precise plating patterns while minimizing leaching and adhesion deterioration of the photosensitive layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability and yield of plating patterns by preventing cracks, reducing peeling times, and mitigating issues like leaching and weakened adhesion, while also simplifying the process by eliminating the need for high-temperature treatments.
Implementation Method 1
a side surface of the second plating layer has a first surface roughness transferred by the plurality of protrusions
Implementation Method 2
forming a second plating layer in the trench by immersing the photosensitive material layer and the first plating layer in a plating solution
Implementation Method 3
forming a plating pattern layer in the trench by immersing the photosensitive material layer and the plating seed layer in a plating solution and applying a voltage to the plating seed layer
Implementation Method 4
forming a superhydrophobic film on a surface of the photosensitive material layer
Data Source
AI summary
A method of forming a plating pattern includes forming a first plating layer on a substrate, forming a photosensitive material layer on the first plating layer, patterning the photosensitive material layer to have a trench exposing a portion of the first plating layer, forming a superhydrophobic film on a surface of the photosensitive material layer, forming a second plating layer in the trench by immersing the photosensitive material layer and the first plating layer in a plating solution, and simultaneously removing the superhydrophobic film and the photosensitive material layer.