Double-Sided Plating Apparatus with Protection Current

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional plating apparatuses face issues with surface roughness due to corrosion of the plating film on one face of the substrate before plating is completed on the other face, and existing solutions do not effectively prevent corrosion or ensure double-sided plating.

Innovation Solution

A method involving a plating apparatus that supplies different plating current densities to each face of the substrate and provides a protection current with a lower current density after initial plating completion to prevent corrosion and ensure uniform film formation on both faces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If double-sided plating is performed without protection current, then plating can be completed on both faces, but the plating film on the first completed face is corroded by the plating solution during the waiting period

Engineering Contradiction:

Improveplating film qualityVSAvoidcorrosion of plating film

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary anti-action by supplying protection current in the same direction as the plating current before the substrate is removed from the plating solution. This protection current creates a protective effect that prevents the plating solution from corroding the already-formed plating film on the first completed face, thereby counteracting the harmful corrosion effect in advance

Inventive Principle:

Principle #9Preliminary anti-action

2Reliability

If a diode is used to prevent reverse current flow, then current direction is controlled, but the plating film surface is still corroded by the strong acid plating solution

Engineering Contradiction:

Improvecurrent direction controlVSAvoidsurface corrosion and roughness increase

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent implements preliminary anti-action by introducing a protection current that flows in the same direction as the plating current. This protection current actively counteracts the corrosive effect of the plating solution on the plating film surface, preventing roughness increase even though the plating solution remains in contact with the substrate

Inventive Principle:

Principle #9Preliminary anti-action

3Productivity

If plating current is supplied to both faces simultaneously, then double-sided plating is achieved, but the first completed face remains exposed to plating solution causing corrosion

Engineering Contradiction:

Improvedouble-sided plating efficiencyVSAvoidexposure time of completed face

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The patent applies continuity of useful action by maintaining current flow in the form of protection current even after plating is completed on one face. This continuous current supply ensures that the beneficial protective effect persists throughout the entire period from completion of first face plating until substrate removal, eliminating the harmful exposure period

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The protection current is supplied in advance and continues until substrate removal, creating a protective environment that prevents corrosion during the necessary waiting period when one face is completed before the other

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively suppresses corrosion and additional deposition on the completed face, maintaining surface smoothness and ensuring consistent plating quality even when plating times differ between faces.

Implementation Method 1

a plating process of respectively supplying electric current of a first plating current density and electric current of a second plating current density to the first face and to the second face of the substrate, so as to form a plating film on the first face and a plating film on the second face

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 2

supplying protection current to the face where plating is completed first, wherein the protection current has a smaller current density than the first plating current density or the second plating current density

Methodology Applied

Scientific EffectElectrochemical protection: Electroplating

Data Source

PatentUS11542629B2Method of plating, apparatus for plating, and non-volatile storage medium that stores program

Publication Date: 2023.01.03 EBARA CORP

AI summary

There is provided a method of plating, comprising: a process of providing a substrate that includes a first face and a second face having different patterns; a plating process of respectively supplying electric current of a first plating current density and electric current of a second plating current density to the first face and to the second face of the substrate, so as to form a plating film on the first face and a plating film on the second face; and a process of, after plating is completed first either on the first face or on the second face, supplying protection current to the face where plating is completed first, wherein the protection current has a smaller current density than the first plating current density or the second plating current density of the electric current supplied to the face where plating is completed first during plating.