Plating Apparatus Radial Nozzle Segmentation for Uniform Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The plating process using electroless plating liquid on copper wiring is affected by varying reaction conditions across the substrate, with the temperature of the plating liquid decreasing from the central to the peripheral portion, leading to discrepancies in reaction conditions.
Innovation Solution
A plating apparatus and method that includes a discharging device with a first nozzle having multiple discharge openings in the radial direction and a second nozzle positioned closer to the central portion, allowing for targeted distribution of the plating liquid to both the central and peripheral areas, thereby maintaining consistent reaction conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is rotated and plating liquid is supplied from a single nozzle, then the plating liquid flows uniformly across the substrate surface, but the temperature decreases from central to peripheral portion causing reaction condition discrepancies
Solution Approach 1:
The single nozzle is divided into multiple nozzles (first nozzle and second nozzle) with different discharge opening configurations. The first nozzle has multiple discharge openings arranged radially, while the second nozzle has a single discharge opening positioned closer to the central portion. This segmentation allows independent control of plating liquid distribution to different regions of the substrate, enabling temperature compensation and uniform reaction conditions across the entire substrate surface.
2Device complexity
If a single nozzle is used to discharge plating liquid, then the device structure is simple, but the reaction conditions vary across the substrate surface
Solution Approach 1:
Different regions of the substrate are served by nozzles with different discharge characteristics. The first nozzle, positioned for peripheral discharge, has multiple radial discharge openings to distribute liquid evenly across the peripheral region. The second nozzle, positioned closer to the central portion, provides targeted discharge to the central region. This local differentiation ensures that each region receives plating liquid with appropriate flow characteristics to maintain uniform reaction conditions, while the overall device structure remains relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a uniform plating process by maintaining the temperature and reaction conditions across the substrate, resulting in a consistent thickness of the Co coating layer on the entire substrate surface.
Implementation Method 1
a substrate holding/rotating device configured to hold and rotate the substrate
Implementation Method 2
a discharging device configured to discharge the plating liquid toward the substrate held on the substrate holding/rotating device
Implementation Method 3
the temperature of the plating liquid on the substrate may decrease as it goes from the central portion of the substrate toward the peripheral portion thereof
Implementation Method 4
a plating process by supplying an electroless plating liquid onto the surface of the substrate
Data Source
AI summary
A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21. Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.