Plating Apparatus With Ionically Resistive Element for Uniform Thickness

Solution Overview

Problem

Existing cup type electroplating devices face challenges in achieving uniform plating film-thickness on the entire substrate, particularly the outer circumference portion, despite adjustments to the shield opening size and distance.

Innovation Solution

A plating apparatus with an anode mask and an ionically resistive element, where the anode mask's opening diameter and the distance between the substrate holder and ionically resistive element are adjustable, along with a paddle mechanism to maintain consistent solution flow, ensuring uniform plating film-thickness distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the size of the opening of the shield is adjusted and the distance between the shield and the substrate is adjusted, then the plating film-thickness uniformity on the substrate can be improved, but it is difficult to sufficiently uniformize the plating film-thickness on the outer circumference portion of the substrate

Engineering Contradiction:

Improveplating film-thickness uniformityVSAvoiddifficulty in achieving sufficient uniformity on outer circumference

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The shield is divided into multiple segments that can be independently adjusted. Specifically, the shield includes a first shield portion and a second shield portion that can be moved relative to each other, allowing separate control of the opening size and shape. This segmentation enables precise control of the electric field distribution to achieve uniform plating thickness across the entire substrate including the outer circumference portion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield structure incorporates movable components that allow dynamic adjustment during the plating process. The second shield portion can be positioned at different distances from the substrate, and the opening size can be varied, enabling real-time optimization of the electric field distribution to achieve uniform plating thickness across the substrate surface.

Inventive Principle:

Principle #15Dynamics

2Device complexity

If a ring-shaped shield with a fixed opening is used, then the structure is simple, but the plating film-thickness uniformity on the entire substrate cannot be achieved

Engineering Contradiction:

Improveshield structure simplicityVSAvoidplating film-thickness uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The shield is divided into multiple segments that can be independently adjusted. Specifically, the shield includes a first shield portion and a second shield portion that can be moved relative to each other, allowing separate control of the opening size and shape. This segmentation enables precise control of the electric field distribution to achieve uniform plating thickness across the entire substrate including the outer circumference portion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The shield structure incorporates movable components that allow dynamic adjustment during the plating process. The second shield portion can be positioned at different distances from the substrate, and the opening size can be varied, enabling real-time optimization of the electric field distribution to achieve uniform plating thickness across the substrate surface.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves improved uniformity of plating film-thickness across the substrate by dynamically adjusting the anode mask opening and distance to the ionically resistive element, maintaining consistent solution flow, thereby enhancing plating process uniformity.

Implementation Method 1

The ionically resistive element is arranged at an interval from the anode mask between the substrate held by the substrate holder and the anode mask

Methodology Applied

Scientific EffectIonic resistance: Electrical Resistance

Implementation Method 2

The ionically resistive element is provided with a plurality of holes

Methodology Applied

Scientific EffectFluid flow control:

Implementation Method 3

The cup type electroplating device immerses a substrate (for example, a semiconductor wafer) held by a substrate holder with a surface to be plated facing downward in a plating solution and applies a voltage between the substrate and an anode, thereby depositing a conductive film on the surface of the substrate

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS12351929B2Plating apparatus and plating method

Publication Date: 2025.07.08 EBARA CORP

AI summary

To improve uniformity of a plating film-thickness formed on a substrate.A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.