Substrate Plating Apparatus Bubble Management

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Solution Overview

Problem

Existing substrate plating techniques face challenges in achieving uniform deposition and preventing defects due to bubble formation during the plating process, particularly when the substrate surface looks down, requiring additional units for reversal and leading to potential defects in high-aspect-ratio interconnection patterns.

Innovation Solution

A substrate plating apparatus with a support member allowing the substrate surface to look up, utilizing a plating solution supply member positioned above to discharge solution uniformly, and incorporating inert gas injection and vacuum suction to prevent bubble accumulation, along with a plating bath design that prevents bubble introduction into interconnection trenches.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the substrate surface looks down during plating, then the plating process can be performed, but bubbles accumulate in the plating solution causing defects

Engineering Contradiction:

Improveplating qualityVSAvoidbubble accumulation

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The substrate surface orientation is inverted from looking down to looking up during the plating process. This inversion changes the bubble behavior from accumulating on the substrate surface to rising away from it, eliminating the harmful effect of bubbles while maintaining effective plating deposition

Inventive Principle:

Principle #13The other way round (Inversion)

2Object-affected harmful factors

If the substrate surface looks up during plating, then bubbles are prevented from accumulating, but the apparatus structure becomes more complex due to additional reversal units

Engineering Contradiction:

Improvebubble preventionVSAvoidapparatus structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

Instead of inverting the substrate orientation, the plating solution supply and collection system is inverted to work from above, allowing the substrate to remain in a simple upward-facing position while still achieving bubble-free plating

Inventive Principle:

Principle #13The other way round (Inversion)

3Device complexity

If the substrate surface looks down, then the apparatus structure is simpler, but bubbles rise and stay on contact holes or trenches causing defects

Engineering Contradiction:

Improveapparatus structureVSAvoidinterconnection pattern quality

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The substrate orientation is inverted to look up during plating, which fundamentally changes bubble behavior from defect-causing to harmless, while the apparatus maintains simplicity by using a straightforward top-down solution supply approach rather than complex reversal mechanisms

Inventive Principle:

Principle #13The other way round (Inversion)

4Manufacturing precision

If plating solution is supplied from above, then uniform deposition is achieved, but bubbles may be introduced into interconnection trenches

Engineering Contradiction:

Improveplating layer uniformityVSAvoidbubble introduction into trenches

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The substrate orientation is inverted to look up, which reverses the bubble movement direction from entering trenches to rising away from them, while maintaining uniform plating deposition through controlled solution supply from above

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures uniform plating layer deposition without substrate reversal, simplifies the apparatus structure, and prevents plating defects by managing bubble release, thereby enhancing the efficiency and quality of the plating process.

Implementation Method 1

a plating solution supply member disposed above the substrate support member, the plating solution supply member discharging a plating solution onto a plating surface of the substrate

Methodology Applied

Scientific EffectGravity: Gravitation

Implementation Method 2

an injection nozzle passing through the support plate and injecting an inert gas onto a non-plated surface of the substrate

Methodology Applied

Scientific EffectGas injection: Injector

Implementation Method 3

the support plate may have a vacuum suction hole vacuum-adsorbing a non-plated surface of the substrate to support the substrate

Methodology Applied

Scientific EffectVacuum suction: Suction

Implementation Method 4

a substrate plating apparatus that performs a metal plating process on a semiconductor substrate

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS8540854B2Apparatus and method for plating substrate

Publication Date: 2013.09.24 SYSTEM ENGINEERING MEGA SOLUTION CO LTD

AI summary

Provided are a substrate plating apparatus and a substrate plating method. In the substrate plating apparatus, a substrate support member supports a substrate to allow a plating surface to look up. A plating solution containing positive ions dissolved from a positive electrode is supplied from a plating solution supply member onto the substrate at an upper side of the substrate support member. A plating bath surrounds the substrate support member. The substrate support member is rotated in a state where it is immersed into the plating solution and an additive. The substrate can be supported by the substrate support member without reversing the substrate. Also, a pattern defect due to bubbles generated during a plating process can be prevented.