Plating Tank Guide Rail Magnetic Attraction PCB Stability
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Solution Overview
Problem
Conventional surface treating apparatuses face issues with printed circuit boards (PCBs) during electroplating, including PCBs coming off or breaking during transportation, uneven plating thickness due to electrical asymmetry, and ineffective regulation of plating solution flow, which leads to defective plating.
Innovation Solution
A surface treating apparatus with a transport hanger equipped with upper and lower grippers and an upper guide rail, along with a plating tank featuring an anode and a member generating an attractive force, ensures the PCB is stretched and secured during processing, using a frame-body member to distribute load and an elastic member to absorb impact, while maintaining symmetrical current flow and regulating plating solution flow through an electric field restrictor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the PCB is continuously stretched in a vertical direction on the transport hanger to prevent shaking during transportation, then the PCB is prevented from shaking, but the PCB may come off or break due to vertical impact
Solution Approach 1:
The transport hanger employs a dynamic stretching mechanism where the PCB is stretched only during the plating process within the plating tank, rather than being continuously stretched during entire transportation. The rise-and-fall mechanism dynamically adjusts the stretching state based on process requirements, reducing unnecessary stress on the PCB during non-plating transportation phases.
Solution Approach 2:
The transportation and processing cycle is segmented into distinct phases: transportation phase without stretching, plating phase with stretching, and post-plating phase without stretching. This segmentation allows the PCB to be stretched only when necessary for quality plating, while avoiding stretching during transportation to prevent damage.
2Stability of the object's composition
If a clamp with electrical asymmetry is used to fix the PCB, then the PCB is securely fixed, but the plating thickness becomes uneven due to different electricity supply to front and back sides
Solution Approach 1:
The invention intentionally introduces a magnetic asymmetric element (magnetic body) that creates an attractive force counterbalancing the electrical asymmetry of the clamp. This magnetic force compensates for the uneven electricity distribution, ensuring uniform plating thickness while maintaining secure PCB fixation through the asymmetric clamp structure.
3Stability of the object's composition
If a porous plate is arranged in the plating solution flow path to regulate flow, then the electric field branching is prevented, but the flow regulation becomes ineffective when plating solution flow is quick
Solution Approach 1:
A magnetic body is introduced as an intermediary element that serves dual functions: it regulates plating solution flow and concentrates the electric field. The magnetic body acts as a mediator between the plating solution flow and the electric field distribution, providing effective flow control even at high flow rates while maintaining uniform electric field concentration.
4Manufacturing precision
If an additional electrode is provided between the anode and PCB to improve electric line of force unevenness, then the electric field distribution is improved, but the flow of plating solution cannot be effectively regulated
Solution Approach 1:
The magnetic body performs multiple functions simultaneously: it acts as an additional electrode to improve electric line of force distribution, serves as a flow regulator for plating solution, and provides structural support. This multi-functional element eliminates the need for separate components, achieving both electric field uniformity and effective flow regulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This setup improves the quality of plate processing by preventing dropout and damage, ensuring uniform plating thickness and effective electric field concentration, thus enhancing the overall electroplating process.
Implementation Method 1
a member that is provided at a predetermined position of the tank body and that generates an attractive force against the lower gripper of the transport hanger
Data Source
AI summary
To prevent a plate-like work in a plating tank from swinging to improve quality of plating and prevent dropout or damages of a printed circuit board during transportation. A plating tank 2a includes an upper guide rail 11 that is provided above the plating tank 2a and transports a transport hanger 15a in a moving direction and a lower guide rail 14 that is provided inside the plating tank 2a and generates an attractive force against a lower clamp 49 of the transport hanger 15a. In the plating tank 2a, an attractive force is generated while performing plate processing to pull the lower clamp 49 of the transport hanger 15a downward, thereby giving tension to a plate-like work W.