Plating Apparatus Top Plate Gas Flow Impediment
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Solution Overview
Problem
The existing plating processes face challenges in maintaining uniform reaction conditions due to temperature variations of the plating liquid across the substrate, leading to non-uniform thickness of the plating layer, even when using a nozzle movement method to discharge the plating liquid.
Innovation Solution
A plating apparatus and method that includes a substrate holding device, a first discharge device with a movable discharge unit overlapping with a top plate's opening, which impedes gas flow to maintain the substrate's ambient atmosphere temperature, ensuring consistent plating liquid temperature and uniform layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is rotated and the plating liquid is supplied to the substrate, then the plating liquid flows uniformly across the substrate surface, but the temperature of the plating liquid decreases from the central portion to the periphery portion of the substrate
Solution Approach 1:
The patent applies parameter changes by heating the plating liquid to a higher temperature before supply, and by controlling the substrate rotation speed and heating conditions to compensate for the temperature gradient that develops during flow. This transforms the temperature parameter to maintain uniform reaction conditions across the substrate despite the inherent cooling effect of flow and rotation
2Manufacturing precision
If the nozzle is moved between the central portion and periphery portion of the substrate, then the plating liquid can be discharged more uniformly, but the temperature of the plating liquid still varies due to heat loss to the ambient atmosphere
Solution Approach 1:
The patent applies preliminary action by pre-heating the plating liquid to a higher temperature before it reaches the substrate. This anticipates the heat loss that will occur during discharge and flow, ensuring that the plating liquid maintains sufficient temperature throughout the process. The heating is performed in advance to compensate for subsequent cooling
3Productivity
If the plating liquid is discharged while the substrate is rotated, then the plating process can be performed uniformly across the entire substrate surface, but the reaction conditions become non-uniform due to temperature variations
Solution Approach 1:
The patent applies parameter changes by adjusting the heating temperature and rotation speed parameters to work together. The substrate is rotated to ensure uniform distribution of plating liquid, while the heating parameters are optimized to maintain consistent temperature across the substrate surface, thereby maintaining uniform reaction conditions despite the dynamic discharge process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses temperature differences across the substrate, resulting in a uniformly thick plating layer by maintaining the plating liquid's temperature and preventing heat loss during the plating process.
Implementation Method 1
a top plate provided above the substrate and having an opening; wherein the first discharge unit is configured to be overlapped with the opening of the top plate at the discharge position
Implementation Method 2
If a temperature of the ambient atmosphere of a substrate is lower than a temperature of a plating liquid, the plating liquid reaching the substrate loses heat to the ambient atmosphere of the substrate
Data Source
AI summary
A plating apparatus 20 includes a substrate holding device 110 configured to hold and rotate the substrate 2; a first discharge device 30 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding device 110; and a top plate 21 that is provided above the substrate 2 and has an opening 22. The first discharge device 30 includes a first discharge unit 33 configured to discharge the plating liquid toward the substrate 2, and the first discharge unit 33 is configured to be moved between a discharge position where the plating liquid is discharged and a standby position where the plating liquid is not discharged. Further, the first discharge unit 33 is configured to be overlapped with the opening 22 of the top plate 21 at the discharge position.