Platinum Surface Encapsulation via Reactive Group Generation
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Solution Overview
Problem
Existing methods fail to provide an effective and stable encapsulation of optoelectronic devices and light-emitting diode chips, particularly due to challenges in depositing a passivation layer directly on surfaces containing platinum, which is chemically inert, and in achieving hermeticity against fluids and gases.
Innovation Solution
The method involves generating reactive oxygen groups or hydroxyl groups on the surface of the optoelectronic device, followed by the deposition of a passivation layer using atomic layer deposition, which enhances adhesion and provides a tight, hermetic encapsulation, specifically using semiconductor or metal oxides like aluminium oxide or silicon oxide, and optionally a further dielectric layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a passivation layer is deposited directly on a platinum surface, then the encapsulation structure is simplified, but the adhesion between the passivation layer and the surface is poor due to the chemical inertness of platinum
Solution Approach 1:
The patent applies preliminary action by performing surface treatment (generating reactive oxygen groups and/or reactive hydroxyl groups) on the platinum surface before depositing the passivation layer. This preliminary modification of the surface chemistry enables the subsequently deposited passivation layer to achieve strong adhesion to the otherwise chemically inert platinum surface, thereby resolving the adhesion problem while maintaining structural simplicity.
2Reliability
If the surface is treated to generate reactive groups for improved adhesion, then the adhesion of the passivation layer is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies parameter changes by modifying the chemical state of the platinum surface through controlled generation of reactive oxygen groups and/or reactive hydroxyl groups. This chemical parameter change enables strong adhesion of the passivation layer without requiring complex physical or structural modifications, thus achieving improved adhesion with minimal increase in process complexity.
3Ease of manufacture
If conventional encapsulation methods are used, then the process is simple, but hermeticity against fluids and gases cannot be achieved
Solution Approach 1:
The patent applies the intermediary principle by introducing a chemically active surface layer (reactive oxygen groups and/or reactive hydroxyl groups) as an intermediary between the platinum surface and the passivation layer. This intermediary enables hermetic encapsulation by creating strong chemical bonds that prevent fluid and gas penetration, while the overall process remains relatively simple through the use of standard surface treatment and ALD deposition techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved adhesion and hermetic encapsulation properties, effectively protecting the device from moisture and gases, even on surfaces with mixed materials like platinum, gallium nitride, and silicon oxide, enhancing the mechanical stability and performance of the optoelectronic devices.
Implementation Method 1
generating reactive oxygen groups and/or reactive hydroxyl groups on the surface
Implementation Method 2
depositing a passivation layer by atomic layer deposition on the surface
Data Source
AI summary
A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface.