Plenoptic Camera Array Layout for Calibration-Free 3D Gigapixel Imaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing imaging technologies face challenges in capturing large, high-resolution, 3D gigapixel images, particularly when aligning multiple images with high accuracy, especially for X-ray imaging, which requires calibration to stitch together visible and X-ray images.
Innovation Solution
A 3D gigapixel plenoptic camera (GIPC-3D) with fixed sensor and optics arrays, capable of capturing visible and X-ray images in a single exposure, using a multi-layered approach with tiled sensor arrays and optics arrays to eliminate the need for calibration, enabling stereoscopic views without moving the camera.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple images are stitched together to achieve large field of view and high resolution, then the image coverage area increases, but the alignment accuracy deteriorates
Solution Approach 1:
The imaging system divides the large field of view into multiple sub-fields, each captured by a separate sensor element or sensor array. Each sub-field is imaged independently with its own optics-sensor pair, eliminating the need to stitch images together while maintaining high resolution across the entire gigapixel field of view.
Solution Approach 2:
The patent transitions from a 2D image stitching approach to a 3D spatial arrangement of multiple optics-sensor pairs. By positioning multiple sensor arrays at different locations and orientations in three-dimensional space, the system captures a gigapixel field of view simultaneously without requiring post-capture alignment and stitching operations.
2Measurement precision
If calibration is performed to align visible and X-ray images, then the alignment accuracy improves, but the time and complexity increase
Solution Approach 1:
The relative positions and orientations of the optics arrays and sensor arrays are predetermined and fixed during manufacturing. This preliminary configuration eliminates the need for time-consuming calibration procedures, as the geometric relationships between visible and X-ray imaging paths are already established and maintained throughout the device's operation.
Solution Approach 2:
The system maintains alignment through its fixed structural design, where the optics and sensors are rigidly mounted relative to each other. This self-maintaining configuration automatically preserves alignment accuracy without requiring external calibration operations or active adjustment mechanisms.
3Measurement precision
If multiple sensors are used to capture gigapixel images, then the resolution and field of view improve, but the device complexity increases
Solution Approach 1:
Each optics-sensor pair is designed to perform multiple functions: capturing visible light images, capturing X-ray images (with appropriate converters), and providing spatial reference information. This multi-functionality reduces the need for separate dedicated components for each imaging modality, thereby managing device complexity while achieving gigapixel resolution across multiple spectral ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the capture of gigapixel images, including 3D and X-ray images, with improved alignment and resolution, allowing for wide-spectrum imaging without the need for calibration, and facilitating applications in various fields.
Implementation Method 1
an X-ray radiation conversion array and an optics array are disposed over a CMOS imaging sensor (CIS) array
Data Source
AI summary
Described are embodiments of a multi-layer giga-pixel plenoptic camera that enable three-dimensional (3D) light-field imaging, high resolution and large field-of-view. In embodiments, the camera includes a radiation conversion array layer, an optics array layer, a complementary metal-oxide-semiconductor (CMOS) image sensor array layer, and a memory layer. Depending on the embodiment, the sequence of the radiation conversion array layer and the optics array layer may be reversed, and/or additional isolation layers may be provided between some of the layers. Applications can span the visible light spectrum, and can include ultraviolet (UV) and infrared (IR) spectra. In an embodiment, applications can span x-ray spectra and gamma ray spectra. Radiation converters in the radiation conversion array layer can be filters or scintillation converters. Optics in the optics array layer can be lenses or pinholes and/or coded apertures.