Panel Level Packaging Alignment Carrier with Local Marks
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Solution Overview
Problem
Conventional panel level packaging techniques suffer from positioning errors due to geometry, temperature, and vibration issues, leading to distortion and displacement of dies on the panel, which negatively affects the bonding process yield and costs.
Innovation Solution
An alignment carrier with local alignment marks and an integrated camera module is used in conjunction with a die bonder to precisely align and bond dies, minimizing distortion effects and improving positional accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional PLP techniques use global reference marks and predetermined positioning, then packaging throughput is increased, but positioning accuracy deteriorates due to geometry, temperature, and vibration issues causing distortion and displacement
Solution Approach 1:
The patent divides the panel into multiple die bond regions, each with its own local alignment marks. This segmentation allows each region to be aligned independently using local references rather than relying on global reference marks, thereby maintaining high positioning accuracy across the entire panel while preserving the throughput benefits of parallel processing
Solution Approach 2:
The patent implements local alignment marks at each die bond region instead of using uniform global reference marks. This local quality approach ensures that each bonding location has its own precise reference points, compensating for local distortion and displacement caused by temperature, vibration, and geometric issues, thus maintaining high positioning accuracy throughout the panel
2Quantity of substance
If the panel size is increased to accommodate more dies, then packaging capacity is improved, but distortion and displacement increase due to thermal cycles and geometry issues
Solution Approach 1:
By dividing the large panel into multiple die bond regions with local alignment marks, the patent enables independent alignment of each region. This segmentation strategy allows the panel to scale in size while maintaining positioning accuracy, as each local region can be aligned separately without being affected by distortion in other parts of the panel
Solution Approach 2:
The patent introduces a new dimension of alignment by adding local alignment marks within each die bond region, supplementing the traditional global reference system. This multi-level alignment approach (global + local) enables accurate positioning even as panel size increases, effectively managing distortion across large areas
3Duration of action of stationary object
If thermal cycles are experienced during reconstruction or carrier reuse, then carrier durability is improved, but distortion increases causing greater displacement of dies from calculated locations
Solution Approach 1:
The patent performs alignment using local alignment marks immediately before die bonding, compensating for any distortion that has accumulated during thermal cycles and carrier reuse. This preliminary alignment action ensures that even though the carrier has undergone thermal expansion and contraction, the dies are positioned accurately at their target locations just before bonding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy and scalability of the die bonding process, reducing errors and costs by allowing for precise alignment and bonding of dies on the alignment carrier, thereby improving yield and processing efficiency.
Implementation Method 1
an alignment system having a camera module configured for aligning dies or devices on the alignment carrier for die bonding
Implementation Method 2
The integrated camera module is further configured to view upwards in the vertical direction for viewing a bottom surface of a die when attached to a bond head of the die bonder
Data Source
AI summary
Panel level packaging (PLP) with high accuracy and high scalability is disclosed. The PLP employs an alignment carrier with a low coefficient of expansion which is configured with die regions having local die alignment marks. For example, local die alignment marks are provided for each die attach region. Depending on the size of the panel, it may be segmented into blocks, each with die regions with local die alignment marks. In addition, a block includes an alignment die region configured for attaching an alignment die. Linear and non-linear positional errors are reduced due to local die alignment marks and alignment dies. The use of local die alignment marks and alignment dies results in increase yields as well as scaling, thereby improving throughput and decreasing overall costs.