Plug Assembly Thermal Path for PCB-to-Cover Heat Dissipation
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Solution Overview
Problem
The existing plug assemblies with heat dissipation functions, such as QSFP interfaces, suffer from reduced heat conduction and dissipation efficiency due to a decreased contact area between the circuit board and the cover, leading to inadequate heat transfer.
Innovation Solution
The proposed plug assembly features a design with an upper and lower cover, a circuit board, and a heat-conducting element, where the circuit board has first and second contact portions that increase contact areas with the covers, and a heat-conducting pipe that enhances heat transfer, along with heat dissipation fins for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the plug assembly uses a cover with radiating fins for heat dissipation, then the heat dissipation area is increased, but the contact area between the circuit board and the cover is decreased, leading to worse heat conduction effect
Solution Approach 1:
The heat conduction path is segmented into multiple contact points: the circuit board has first contact portions at two sides that contact the covers, and second contact portions at the middle region of the top surface that contact the heat-conducting element. This segmentation allows heat to be conducted through multiple pathways simultaneously, increasing the effective contact area while maintaining the radiating fins for heat dissipation surface area.
Solution Approach 2:
A heat-conducting element is introduced as an intermediary between the circuit board and the cover. The heat-conducting element includes a heat-conducting pipe that contacts the second contact portions on the circuit board and extends to contact the cover, thereby mediating the heat transfer from the circuit board to the cover and increasing the effective contact area for heat conduction.
2Ease of manufacture
If the plug assembly structure is simplified, then the manufacturing complexity is reduced, but the heat conduction path efficiency is decreased
Solution Approach 1:
The heat-conducting element is integrated with the cover structure, where the heat-conducting pipe is formed as part of the cover assembly. This merging reduces the number of separate components and assembly steps while maintaining an efficient heat conduction path from the circuit board through the heat-conducting element to the cover and radiating fins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat conduction and dissipation efficiency by increasing contact areas and heat dissipation surfaces, allowing for more effective heat energy transmission and dissipation.
Implementation Method 1
heat energies generated by the plug assembly are transmitted through a heat conduction path
Implementation Method 2
the circuit board has two first contact portions at two sides, and the two first contact portions contact the lower cover and the upper cover
Implementation Method 3
a heat dissipation purpose is reached by use of the multiple radiating fins
Implementation Method 4
a heat dissipation purpose is reached by use of the multiple radiating fins
Data Source
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AI summary
A plug assembly includes a lower cover (1), an upper cover (2) mounted on the lower cover, and a circuit board (4). The upper cover (2) is equipped with a heat-conducting element (22). The circuit board (4) is mounted between the upper cover (2) and the lower cover (1). The circuit board (4) has two first contact portions (42) contacting with the lower cover (1) and the upper cover (2), and a plurality of second contact portions (43). The circuit board (4) is equipped with a chip (46). The chip (46) is mounted on and covers the plurality of the second contact portions (43). The chip contacts (46) with the heat-conducting element (22). The circuit board (4) opens at least one perforation (44). At least one of the lower cover (1) and the upper cover (2) protrudes towards the circuit board (4) to form at least one fastening portion (441) passing through the at least one perforation (44) and contacting with the at least one of the upper cover (2) and the lower cover (1).